XCKU15P-1FFVA1156E

The XCKU15P-1FFVA1156E is a Kintex UltraScale+ field programmable gate array (FPGA) IC from AMD. It delivers large programmable logic capacity and embedded memory in a surface-mount FCBGA package for board-level integration.

Key device attributes include approximately 1,143,450 logic elements, approximately 82.3 Mbits of embedded memory, 516 I/O pins, an 1156-FCBGA (35×35 mm) package, an operating voltage range of 825 mV to 876 mV, and an operating temperature range of 0 °C to 100 °C. The device is offered in an extended grade and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 1,143,450 logic elements provide large programmable fabric for complex digital functions.
• Embedded Memory  Approximately 82.3 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive logic.
• I/O and Package  516 I/O pins for broad interfacing options; supplied in a 1156-FCBGA (35×35 mm) surface-mount package (Package Case: 1156-BBGA, FCBGA).
• Power Supply  Specified operating supply range from 825 mV to 876 mV to meet core voltage requirements.
• Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for a variety of temperature environments.
• Mounting and Compliance  Surface-mount device with RoHS compliance for lead-free assembly processes.

Unique Advantages

• Large programmable fabric: Approximately 1,143,450 logic elements enable the implementation of complex, highly parallel digital designs on a single device.
• Substantial on-chip memory: Approximately 82.3 Mbits of embedded memory reduces dependency on external memory for many buffering and storage tasks.
• Extensive I/O capability: 516 I/O pins support diverse interface requirements without extensive external I/O expansion.
• Compact FCBGA package: 1156-FCBGA (35×35 mm) surface-mount package supports high-density board layouts and reliable soldered attachment.
• Controlled supply requirements: Narrow core voltage range (825 mV–876 mV) simplifies power rail design for the device core.
• RoHS compliant and extended grade: Environmentally compliant construction with an extended operating temperature range for broader deployment scenarios.

Why Choose XCKU15P-1FFVA1156E?

The XCKU15P-1FFVA1156E positions Kintex UltraScale+ FPGA capacity into a compact FCBGA package, combining high logic density, substantial embedded memory, and broad I/O in an extended-grade, RoHS-compliant device. This combination supports designs that require significant on-chip resources while maintaining a compact board footprint and surface-mount assembly.

Engineers and procurement teams looking for a high-capacity FPGA with defined supply and thermal characteristics will find this device suitable for applications requiring integrated logic, memory, and I/O in a single programmable component. Detailed technical information is available in the Kintex UltraScale+ series datasheet.

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