XCKU13P-2FFVE900E

The XCKU13P-2FFVE900E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It delivers a high-density programmable logic fabric combined with significant on-chip memory and a substantial I/O count for complex digital designs.

With 746,550 logic elements, approximately 70.7 Mbits of embedded memory, and 304 I/O, this extended-grade, surface-mount device is intended for designs that require large logic capacity, integrated memory, and a compact 900-FCBGA (31×31) package footprint.

Key Features

• Core Architecture  Kintex® UltraScale+™ FPGA family implementation in an AMD device, provided as a field programmable gate array IC.
• Logic Resources  746,550 logic elements for implementing large-scale programmable logic and custom hardware functions.
• Embedded Memory  Approximately 70.7 Mbits (70,656,000 bits) of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O Count  304 general-purpose I/O pins to accommodate multiple interfaces and peripheral connections.
• Power  Core voltage supply range of 825 mV to 876 mV for the device core domain.
• Package & Mounting  900-FCBGA (31×31) package, surface mount, suitable for dense board integration.
• Operating Conditions & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital signal processing  Use the device’s 746,550 logic elements and significant embedded memory to build complex DSP pipelines and real-time processing engines.
• Hardware acceleration and prototyping  Large logic capacity and on-chip RAM support development of accelerators and rapid prototyping of custom silicon functions.
• Embedded system integration  304 I/O allow connection to multiple peripherals and interfaces for advanced embedded control and data aggregation.
• Networking and packet processing  Combine extensive logic resources and memory to implement packet inspection, buffering, and custom networking functions.

Unique Advantages

• High logic capacity: 746,550 logic elements enable complex, large-scale logic implementations without immediate need for external PLDs.
• Substantial on-chip memory: Approximately 70.7 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Ample I/O: 304 I/O pins give flexibility for interfacing multiple peripherals and high-pin-count subsystems.
• Compact, robust packaging: 900-FCBGA (31×31) surface-mount package supports dense PCB layouts while delivering high pin density.
• Predictable power domain: Defined core supply range (825 mV–876 mV) helps with stable power-supply design and board-level planning.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to match applications requiring extended commercial temperature support.

Why Choose XCKU13P-2FFVE900E?

The XCKU13P-2FFVE900E positions itself where high logic density, substantial embedded memory, and significant I/O capacity are required in a compact FCBGA package. Its combination of 746,550 logic elements and approximately 70.7 Mbits of on-chip RAM supports complex processing, buffering, and custom hardware acceleration within a single FPGA device.

This extended-grade Kintex® UltraScale+™ FPGA is suitable for teams and projects that need scalable programmable logic resources, a high pin count for multi-interface designs, and a packaged solution appropriate for dense board layouts. RoHS compliance and a defined operating and supply range simplify integration and system-level planning.

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