XCKU13P-1FFVE900E

The XCKU13P-1FFVE900E is a Kintex® UltraScale+™ FPGA IC from AMD, packaged in a 900-ball FCBGA. It provides a large on-chip resource set designed for applications that require substantial logic capacity, embedded memory, and a high I/O count within a surface-mount 900-FCBGA (31×31) footprint.

This device is offered in an extended grade with a defined operating temperature range and a specified supply voltage window, suitable for designs that must meet those environmental and power constraints.

Key Features

• Logic Capacity  The device includes 746,550 logic elements and 42,660 CLBs, providing extensive programmable logic resources for complex designs.
• Embedded Memory  Approximately 70.656 Mbits of on-chip RAM (70,656,000 bits) for buffering, lookup tables, and data storage close to logic.
• I/O Count  304 dedicated I/O pins to support broad peripheral and interface connectivity requirements.
• Package  900-ball FCBGA (900-FCBGA, 31×31) package case, surface-mount mounting type, suitable for dense PCB layouts.
• Power Supply Range  Specified core supply voltage range from 825 mV to 876 mV for consistent power planning.
• Temperature Grade  Extended grade device with an operating temperature range of 0°C to 100°C.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: 746,550 logic elements and 42,660 CLBs enable large-scale programmable designs within a single FPGA device.
• Significant embedded memory: Approximately 70.656 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage needs.
• Extensive I/O capability: 304 I/Os allow support for multiple interfaces and parallel connectivity without adding external expander components.
• Compact, high-ball-count package: 900-FCBGA (31×31) delivers high pin count in a compact surface-mount form factor for space-constrained boards.
• Defined power envelope: Narrow supply range (825 mV–876 mV) simplifies core power budgeting and regulation design.
• Extended operating range: Rated for 0°C to 100°C operation to meet applications that require this specific temperature window.

Why Choose XCKU13P-1FFVE900E?

The XCKU13P-1FFVE900E combines a large number of logic elements, considerable embedded memory, and a high I/O count in a 900-ball FCBGA package, making it suitable for designs that require substantial on-chip resources in a compact footprint. Its extended grade operating range, defined supply voltage window, and RoHS compliance provide deterministic parameters for system-level planning.

This part is well suited to projects that need to consolidate logic and memory on-chip while maintaining a high density of external interfaces. The device’s package and surface-mount mounting type support dense PCB integration where board space and pin count are key considerations.

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