XCKU13P-1FFVE900I

The XCKU13P-1FFVE900I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC designed for high-density, reprogrammable logic implementations. It provides a large logic capacity and substantial on-chip memory to support complex digital processing and system integration in industrial environments.

With a 900-FCBGA (31×31) package, 304 user I/O and an industrial operating temperature range, this device targets applications that require significant logic resources, abundant embedded memory, and durable operation across extended temperature conditions.

Key Features

• Core Logic  Approximately 746,550 logic elements for implementing complex custom logic, state machines and high‑throughput datapaths.
• Embedded Memory  Approximately 70.7 Mbits of on-chip RAM to support buffering, FIFOs and local storage for data‑intensive designs.
• I/O Capacity  304 user I/O pins to interface with peripherals, high‑speed transceivers or multi‑lane external devices.
• Package and Mounting  900-FCBGA (31×31) package in a surface-mount form factor, offering a compact, high‑density footprint.
• Power Supply  Core/operating voltage range specified between 825 mV and 876 mV for compatibility with low‑voltage power domains.
• Temperature and Grade  Industrial grade device rated for operation from −40 °C to 100 °C, suitable for deployed equipment in varied ambient conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Use the FPGA’s large logic and memory resources to implement motor control, sensor aggregation, and real‑time processing in industrial equipment operating across wide temperature ranges.
• Telecommunications Infrastructure  Deploy as protocol processing, packet buffering, or interface bridging hardware where high logic density and substantial embedded RAM are required.
• Imaging and Vision Systems  Implement preprocessing, frame buffering and custom image pipelines using the device’s logic capacity and on‑chip memory.
• High‑Density Digital Systems  Integrate complex, configurable compute and control functions in a compact FCBGA package for space‑constrained system designs.

Unique Advantages

• High logic capacity: The device’s approximately 746,550 logic elements enable large-scale custom logic and parallel datapath implementation, reducing the need for multiple devices.
• Substantial on‑chip memory: Approximately 70.7 Mbits of embedded RAM provides local buffering and storage to support data‑intensive operations without immediate external memory dependence.
• Robust I/O availability: 304 user I/O pins support a wide range of peripheral interfaces and system connections within a single FPGA.
• Compact, assembly‑ready package: The 900‑FCBGA (31×31) surface‑mount package enables high density integration in modern PCB designs.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in systems exposed to extended ambient conditions.
• Low-voltage core operation: Specified supply range of 825 mV to 876 mV supports integration with low‑voltage power architectures.

Why Choose XCKU13P-1FFVE900I?

The XCKU13P-1FFVE900I delivers a combination of high logic density, significant embedded memory and broad I/O capability in a compact FCBGA package, targeted at industrial applications and high‑density digital systems. Its operating voltage and temperature specifications make it suitable for designs that demand robust operation and integration into modern low‑voltage platforms.

This device is appropriate for engineering teams building complex, reprogrammable hardware where on‑chip resources and durable operation are key selection criteria. Use it to consolidate functions, reduce board count and implement sophisticated, application‑specific hardware acceleration or control logic.

Request a quote or submit an inquiry to check availability and pricing for the XCKU13P-1FFVE900I and to discuss how it can fit into your next design.