XCKU15P-1FFVE1760E

The XCKU15P-1FFVE1760E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, provided in a 1760-FCBGA package. It combines high logic capacity and on-chip memory with a large I/O count and a compact surface-mount FCBGA footprint for board-level integration.

Key hardware characteristics include approximately 1,143,450 logic elements, roughly 82.33 Mbits of embedded memory, 668 I/O, supply voltage in the 0.825–0.876 V range, and an operating temperature range of 0°C to 100°C. The device is RoHS compliant and specified as Extended grade.

Key Features

• Core Logic Capacity  Approximately 1,143,450 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 82.33 Mbits of on-chip RAM to support buffering, state storage, and high-throughput data handling.
• High I/O Count  668 I/O pins to accommodate multiple external interfaces and parallel connections.
• Power Supply Range  Core voltage specified at 0.825–0.876 V to match system power-rail requirements.
• Package and Mounting  1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount format for compact board integration.
• Operating Range & Grade  Extended-grade device rated for operation from 0°C to 100°C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Designs requiring large programmable logic and substantial on-chip memory benefit from the device's logic element and RAM capacity.
• I/O-intensive boards  Systems that need many external interfaces can leverage the 668 available I/O connections.
• Compact, board-level integration  The 1760-FCBGA surface-mount package supports space-constrained PCB designs while providing a high pin count.
• Extended-temperature deployments  Applications operating within 0°C to 100°C can use this Extended-grade FPGA to meet environmental requirements.

Unique Advantages

• High integration density: Large logic and memory resources reduce the need for external components and simplify system design.
• Broad I/O capability: 668 I/O connections enable direct interfacing to many peripherals and parallel subsystems without extensive multiplexing.
• Compact FCBGA package: The 1760-FCBGA (42.5 × 42.5 mm) footprint balances pin count with board-area efficiency.
• Low-voltage core: Core supply specified at 0.825–0.876 V supports modern low-voltage system designs.
• Extended operating range: Rated for 0°C to 100°C operation to meet a wide set of deployment environments.
• Environmental compliance: RoHS compliance supports regulatory and sustainability requirements.

Why Choose XCKU15P-1FFVE1760E?

The XCKU15P-1FFVE1760E is positioned for designs that require substantial programmable logic, significant embedded memory, and a high I/O count within a compact FCBGA package. Its combination of approximately 1,143,450 logic elements, roughly 82.33 Mbits of on-chip RAM, and 668 I/O makes it suitable for complex digital implementations where integration and board-level density matter.

With Extended-grade operation from 0°C to 100°C, a low-voltage core supply range, and RoHS compliance, this AMD Kintex® UltraScale+™ FPGA offers a balance of performance, integration, and environmental conformity for engineering teams focused on scalable, robust hardware designs.

Request a quote or contact sales to discuss pricing, availability, and how XCKU15P-1FFVE1760E can fit your next design.