XCKU15P-2FFVE1760E

The XCKU15P-2FFVE1760E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC delivering very high logic density, abundant embedded memory, and a large I/O count in a 1760-ball FCBGA package. It is designed for systems that require substantial on-chip resources and flexible I/O while operating from a low-voltage supply.

This device suits applications that need extensive programmable logic and memory, offering approximately 1,143,450 logic elements, roughly 82.33 Mbits of embedded memory, and 668 I/Os. It is supplied in a surface-mount 1760-FCBGA (42.5×42.5 mm) package, rated for extended-grade operation from 0 °C to 100 °C and RoHS compliant.

Key Features

• Programmable Logic Approximately 1,143,450 logic elements for implementing large-scale digital designs, complex datapaths, and custom accelerators.
• Embedded Memory Approximately 82.33 Mbits of on-chip RAM to support buffering, look-up tables, and on-chip data storage for high-throughput designs.
• I/O Capacity 668 general-purpose I/O pins to support wide parallel interfaces, multi-channel data acquisition, and complex board-level connectivity.
• Power and Supply Low-voltage core operation with a specified supply range of 825 mV to 876 mV to match system power-rail requirements.
• Package and Mounting 1760-FCBGA (42.5×42.5 mm) package, surface-mount mounting for high-density PCB implementations.
• Operating Range and Grade Extended-grade device specified for operation from 0 °C to 100 °C, suitable for a wide range of commercial and industrial-adjacent environments.
• Regulatory RoHS compliant for use in designs requiring lead-free component compliance.

Typical Applications

• High-density signal processing — Uses the large number of logic elements and embedded RAM to implement multi-channel DSP, filtering, and real-time data manipulation.
• Network and communications equipment — Leverages abundant I/O and on-chip memory for packet processing, protocol handling, and high-speed interface aggregation.
• Video and imaging systems — Implements image pipelines, frame buffering, and parallel video processing using the device’s logic and memory resources.
• Embedded compute acceleration — Deploys custom accelerators and offload engines to boost throughput in compute-heavy embedded systems.

Unique Advantages

• High logic density: Approximately 1,143,450 logic elements enable integration of large, complex functions on a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 82.33 Mbits of embedded RAM supports large buffers and state storage without external memory dependence.
• Large I/O footprint: 668 I/Os provide flexibility for parallel interfaces, high channel counts, and extensive peripheral connectivity.
• Compact FCBGA package: 1760-FCBGA (42.5×42.5 mm) balances high integration with a manageable PCB footprint for dense system designs.
• Extended operating range: Rated 0 °C to 100 °C for deployment in environments that require broader temperature tolerance than standard commercial-only parts.
• RoHS compliant: Meets lead-free requirements for modern manufacturing and regulatory compliance.

Why Choose XCKU15P-2FFVE1760E?

The XCKU15P-2FFVE1760E positions itself as a high-capacity, flexible FPGA solution for designs that demand significant logic, memory, and I/O in a single package. Its combination of approximately 1,143,450 logic elements, around 82.33 Mbits of embedded memory, and 668 I/Os makes it well suited to complex signal processing, communications, and embedded acceleration tasks where integration and scalability are key.

With surface-mount 1760-FCBGA packaging, extended-grade temperature range, and RoHS compliance, the device supports robust system implementations and long-term design planning where on-board resource consolidation and predictable operating conditions are important.

Request a quote or submit a purchase inquiry to begin integrating the XCKU15P-2FFVE1760E into your next high-density FPGA design.