XCKU15P-L2FFVA1156E

The XCKU15P-L2FFVA1156E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD delivering very high logic capacity and substantial on-chip memory in a 1156-ball FCBGA package. It is designed for applications that require large numbers of logic elements, significant embedded RAM, and a high I/O count within a surface-mount footprint.

Key attributes include approximately 1,143,450 logic elements, roughly 82.3 Mbits of embedded memory, 516 I/O signals, an extended temperature grading, and a low-voltage core supply range—making it suitable for complex programmable logic implementations where integration and density matter.

Key Features

• Logic Capacity  Approximately 1,143,450 logic elements for implementing large-scale programmable logic, custom datapaths, and complex state machines.
• Embedded Memory  Approximately 82.3 Mbits of on-chip RAM to support buffering, large lookup tables, and memory-intensive algorithms without external memory.
• I/O Resources  516 I/O signals to interface with multiple peripherals, high-pin-count subsystems, and board-level connectivity requirements.
• Package and Mounting  1156-BBGA / FCBGA package (supplier package: 1156-FCBGA (35x35)) in a surface-mount form factor for dense board-level integration.
• Power and Voltage  Core voltage supply specified from 698 mV to 876 mV to match system power-rail planning and low-voltage FPGA designs.
• Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring higher-than-commercial thermal tolerance.
• Regulatory  RoHS compliant, supporting compliance requirements for restricted substances.

Typical Applications

• High-density digital processing  Implement large custom datapaths and parallel processing engines using the FPGA’s extensive logic elements and embedded RAM.
• Interface aggregation  Connect and manage many peripheral signals or protocol bridges using the device’s 516 I/O resources in a single package.
• On-chip buffering and lookup-heavy logic  Leverage approximately 82.3 Mbits of embedded memory for packet buffering, LUT-based functions, and intermediate data storage without relying on external memory.

Unique Advantages

• High integration density:  The combination of about 1,143,450 logic elements and significant on-chip RAM reduces reliance on external logic and memory, simplifying board designs.
• Large I/O count:  516 I/O signals enable consolidation of multiple interfaces onto a single device, lowering BOM complexity and interconnect routing.
• Compact surface-mount packaging:  The 1156-FCBGA package supports high-density board layouts while providing the pin count needed for demanding designs.
• Low-voltage core support:  A defined supply range of 698 mV to 876 mV helps system designers plan power distribution and thermal profiles precisely.
• Extended temperature rating:  Operation from 0 °C to 100 °C offers a wider operating window than standard commercial-grade parts for thermally demanding deployments.
• RoHS compliant:  Helps address regulatory and environmental requirements for restricted substances.

Why Choose XCKU15P-L2FFVA1156E?

The XCKU15P-L2FFVA1156E positions itself as a high-capacity, board-friendly FPGA option within the Kintex® UltraScale+™ line, combining over one million logic elements, substantial embedded memory, and a large I/O complement in a 1156-ball FCBGA surface-mount package. Its extended temperature grading and defined core voltage range make it suitable for designs that require reliable operation across a wider thermal envelope and precise power planning.

This part is well suited for engineering teams building dense, memory- and logic-intensive programmable solutions that benefit from consolidation onto a single FPGA. The device’s capacity and packaging support long-term design scalability while keeping system-level integration and routing manageable.

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