XCKU19P-2FFVB2104I

The XCKU19P-2FFVB2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD offered in a 2104-FCBGA package. It provides a very large programmable fabric with a high count of logic elements and substantial on-chip RAM for complex digital designs.

Targeted for industrial applications, the device combines extensive I/O and a compact FCBGA footprint with an industrial operating temperature range and RoHS compliance to support demanding system-level deployments.

Key Features

• Logic Capacity  1,842,750 logic elements to implement large-scale programmable logic and complex custom functions.
• Embedded Memory  Approximately 63.75 Mbits of embedded memory for on-chip buffering, state storage, and intermediate data processing.
• I/O and Package  540 programmable I/O pins in a 2104-FCBGA package (47.5 × 47.5 mm), supporting dense system interfaces while using a surface-mount footprint.
• Power  Core voltage supply range of 825 mV to 876 mV for designs targeting this narrow supply window.
• Thermal and Grade  Industrial grade operation across −40 °C to 100 °C, suitable for temperature-demanding environments.
• Compliance  RoHS compliant to meet environmental and regulatory requirements.

Typical Applications

• Industrial Control and Automation  Large logic capacity and industrial temperature range enable deployment in control systems, PLCs, and factory automation equipment.
• High-Density I/O Systems  540 I/O pins support complex sensor networks, interface aggregation, and multi-channel data routing.
• Embedded Processing and Acceleration  Substantial on-chip memory and logic resources fit designs that require custom hardware acceleration and large-scale programmable logic.

Unique Advantages

• Extensive Logic Resources:  1,842,750 logic elements give designers room to implement large, integrated digital systems without immediate upsizing.
• Significant On-Chip Memory:  Approximately 63.75 Mbits of embedded memory reduces external memory dependence for buffering and intermediate storage.
• High I/O Count in a Compact Package:  540 I/Os in a 2104-FCBGA (47.5 × 47.5 mm) package deliver dense connectivity while retaining a surface-mount form factor.
• Industrial Temperature Range:  Rated for −40 °C to 100 °C operation to address temperature-challenging installations.
• RoHS Compliant:  Meets RoHS requirements to support environmentally conscious product designs and regulatory needs.
• Tight Core Voltage Window:  825 mV–876 mV supply range supports designs that manage core power precisely.

Why Choose XCKU19P-2FFVB2104I?

The XCKU19P-2FFVB2104I positions itself as a high-capacity, industrial-grade programmable fabric for engineers building complex digital systems with substantial logic, memory, and I/O requirements. Its combination of nearly 1.85 million logic elements, approximately 63.75 Mbits of embedded RAM, and 540 I/Os in a 2104-FCBGA package provides a balanced platform for integration and system consolidation.

This device is well suited to teams developing large FPGA-based designs that require rugged operation across −40 °C to 100 °C and adherence to RoHS. It offers scalability for evolving hardware needs while maintaining a compact surface-mount package footprint.

Request a quote or submit a sales inquiry to evaluate the XCKU19P-2FFVB2104I for your next high-density, industrial FPGA design.