XCKU19P-2FFVB2104E

The XCKU19P-2FFVB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, offered in a 2104-FCBGA package. It combines very high logic capacity, significant on-chip memory, and a large I/O count to support complex, high-density programmable designs.

Key architectural attributes include approximately 1.84 million logic elements, approximately 64 Mbits of embedded memory, and 540 I/O pins, delivering the integration required for demanding system-level implementations while operating from a low-voltage core supply.

Key Features

• Logic Capacity — Approximately 1,842,750 logic elements to implement large-scale digital logic and custom processing blocks.
• Embedded Memory — Approximately 64 Mbits of on-chip RAM suitable for buffering, lookup tables, and intermediate data storage.
• I/O Density — 540 I/O pins to support extensive external interfacing and multi-channel connectivity.
• Package & Mounting — 2104-BBGA / 2104-FCBGA package (supplier package: 2104-FCBGA, 47.5 × 47.5 mm) with surface-mount assembly.
• Core Voltage — Nominal supply range of 825 mV to 876 mV for core power domains.
• Operating Temperature & Grade — Extended grade with an operating range of 0 °C to 100 °C.
• Regulatory Compliance — RoHS compliant for lead-free assembly and environmental compatibility.

Unique Advantages

• High logic integration: Approximately 1.84 million logic elements reduce the need for multiple devices and simplify complex designs.
• Substantial on-chip memory: Approximately 64 Mbits of embedded RAM supports large buffers and high-throughput data paths without external memory.
• Large I/O complement: 540 I/Os enable extensive peripheral and multi-channel interfacing directly from the FPGA.
• Compact ball-grid package: 2104-FCBGA (47.5 × 47.5 mm) provides a dense, surface-mount form factor for system integration.
• Low-voltage core operation: Core supply range of 825 mV to 876 mV helps align power distribution design with low-voltage system architectures.
• Extended operating range: 0 °C to 100 °C grade supports a broad set of deployment environments.
• RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XCKU19P-2FFVB2104E?

The XCKU19P-2FFVB2104E positions itself as a high-capacity, highly integrated FPGA option for designs that require extensive logic, significant embedded memory, and a high I/O count within a compact FCBGA footprint. Its extended temperature grade, RoHS compliance, and defined low-voltage core supply make it suitable for systems where integration density and power domain considerations are critical.

This part is appropriate for engineering teams and procurement looking for a scalable, high-density programmable device that consolidates complex logic and memory on-chip while providing a large number of external interfaces. The combination of capacity, package density, and compliance attributes supports long-term design stability and manufacturability.

Request a quote or submit a pricing and availability inquiry to receive more information and to begin procurement for XCKU19P-2FFVB2104E.