XCKU3P-1FFVB676E

The XCKU3P-1FFVB676E is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 676‑ball FCBGA package. It delivers a high logic density and sizeable on‑chip memory in a surface‑mount package suited to designs that require substantial programmable logic, embedded memory and a moderate I/O count.

Key Features

• Logic Capacity  355,950 logic elements (cells) to support complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 31.64 Mbits of on‑chip RAM for buffering, data storage and state machines.
• I/O  280 user I/O pins to interface with peripherals, memory and external logic devices.
• Power Supply  Core voltage supply range specified at 825 mV to 876 mV.
• Package and Mounting  676‑ball FCBGA package (supplier package 676‑FCBGA, 27×27), surface mount for PCB assembly.
• Operating Range  Rated for operation from 0 °C to 100 °C; grade indicated as Extended.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density logic designs  Use the device where large numbers of logic elements (355,950) are needed for custom processing, control or protocol implementations.
• On‑chip buffering and storage  Leverage approximately 31.64 Mbits of embedded memory for packet buffering, lookup tables or temporary data storage.
• Peripheral and system interfacing  Employ the 280 I/O pins to connect sensors, memory devices and external controllers in embedded systems and instrumentation.

Unique Advantages

• High programmable density: The large logic element count enables consolidation of complex functions into a single FPGA, reducing system component count.
• Significant on‑chip memory: Approximately 31.64 Mbits of embedded RAM supports localized data storage and low‑latency buffering without external memory.
• Ample I/O resources: 280 user I/Os provide flexibility for multi‑interface designs and board‑level integration.
• Compact FCBGA packaging: The 676‑ball FCBGA (27×27) package offers a high pin count in a surface‑mount form factor suitable for dense PCB layouts.
• Controlled core voltage range: The specified 825 mV–876 mV supply window supports defined power delivery design and regulation.
• Extended operating range and RoHS compliance: Rated for 0 °C to 100 °C operation and compliant with RoHS requirements for materials handling.

Why Choose XCKU3P-1FFVB676E?

The XCKU3P-1FFVB676E positions itself as a solution for designs that require substantial programmable logic, embedded memory and flexible I/O in a surface‑mount, FCBGA package. Its combination of 355,950 logic elements, approximately 31.64 Mbits of on‑chip RAM and 280 I/Os makes it suitable for consolidation of complex digital functions while maintaining board‑level integration and manufacturability.

Supported by AMD’s Kintex UltraScale+ family continuity, this device is appropriate for engineering teams and procurement sourcing looking for a high‑capacity FPGA with defined power and thermal operating parameters and RoHS compliance.

Request a quote or submit an inquiry to receive pricing and lead‑time information for the XCKU3P-1FFVB676E. Our team can provide availability details and assist with procurement planning.