XCKU3P-1FFVD900I

The XCKU3P-1FFVD900I is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD, provided in a 900-ball FCBGA package (31 × 31 mm). It delivers a large programmable logic fabric with substantial on-chip memory and a high I/O count for complex, compact designs.

With an industrial operating temperature range and a defined supply voltage window, this device is targeted at designs that require high logic capacity, significant embedded memory, and robust operation across –40 °C to 100 °C.

Key Features

• Core & Logic 355,950 logic elements provide a large programmable fabric for implementing complex digital logic, state machines, and custom accelerators.
• Embedded Memory Approximately 31.6 Mbits of on-chip RAM for buffering, FPGA-based data processing, and state storage.
• I/O Density 304 user I/O pins to support multiple parallel interfaces and high pin-count connectivity on a single device.
• Power Supply Defined operating supply range from 825 mV to 876 mV to match system power designs and rails.
• Package & Mounting 900-FCBGA (31 × 31 mm) surface-mount package for high-density board designs.
• Operating Range & Grade Industrial grade operation with an ambient temperature range of –40 °C to 100 °C.
• RoHS Compliant Device is RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Industrial Control & Automation — Use the device’s industrial temperature rating and large logic capacity to implement complex control algorithms, motor drives, and real-time processing in harsh environments.
• High-density Embedded Processing — Leverage the high logic element count and embedded RAM to build custom data-paths, protocol handlers, or hardware accelerators within compact system footprints.
• Communications Infrastructure — The combination of numerous I/O and substantial on-chip memory supports interface aggregation, packet buffering, and custom protocol processing.
• Test, Measurement & Instrumentation — Large logic resources and RAM enable precise signal processing, data capture, and real-time analysis functions for bench and rack-mounted equipment.

Unique Advantages

• High on-chip logic capacity: 355,950 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying board design.
• Substantial embedded memory: Approximately 31.6 Mbits of RAM supports large buffers, state machines, and data processing without external memory.
• High I/O count: 304 user I/Os enable integration of multiple parallel interfaces and high-density connectivity on a single device.
• Industrial temperature rating: Operation from –40 °C to 100 °C allows deployment in a wide range of environmental conditions.
• Compact FCBGA footprint: 900-ball 31 × 31 mm package supports high-density PCB layouts while maintaining substantial device capability.

Why Choose XCKU3P-1FFVD900I?

The XCKU3P-1FFVD900I combines a large programmable logic fabric, significant embedded memory, and a high I/O count in a compact 900-FCBGA package, addressing designs that require high integration and robust environmental operation. Its industrial-grade temperature range and defined supply window make it suitable for systems where both capacity and reliability are required.

This device is appropriate for engineering teams building complex embedded systems, communication subsystems, or industrial equipment that benefit from scalable logic resources and on-chip memory. The Kintex® UltraScale+™ designation indicates it is part of a family designed for high-density programmable solutions.

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