XCKU3P-2FFVA676E

The XCKU3P-2FFVA676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. This device provides 355,950 logic elements, approximately 31.64 Mbits of embedded memory, and 256 I/O in a 676-FCBGA (27×27) surface-mount package.

Designed for extended-grade operation, the device runs from 825 mV to 876 mV supply and supports an operating temperature range of 0 °C to 100 °C. It is RoHS‑compliant.

Key Features

• Logic Capacity 355,950 logic elements provide a substantial resource pool for complex programmable logic implementations.
• Embedded Memory Approximately 31.64 Mbits of on-chip RAM to support data buffering, LUT-based storage, and memory-intensive functions.
• I/O Density 256 user I/O pins to support a broad set of external interfaces and high-pin-count interconnects.
• Supply Voltage Operates from 825 mV to 876 mV, enabling integration with systems designed around low-voltage core domains.
• Package and Mounting 676-FCBGA (27×27) package in a surface-mount configuration for compact board-level integration.
• Temperature and Grade Extended-grade device with a specified operating temperature range of 0 °C to 100 °C for deployments within that thermal window.
• Compliance RoHS‑compliant construction for alignment with environmental and manufacturing requirements.

Typical Applications

• FPGA-based prototyping — Leverage the device’s large logic capacity and on-chip RAM to prototype complex digital designs and system architectures.
• High-density I/O aggregation — Use the 256 I/O pins to consolidate multiple external signals and interfaces on a single programmable device.
• Memory-driven processing — Employ the approximately 31.64 Mbits of embedded memory for buffering, streaming data paths, and on-chip data storage.

Unique Advantages

• High logic element count: 355,950 logic elements enable implementation of large-scale logic functions without immediate partitioning across devices.
• Significant embedded RAM: Approximately 31.64 Mbits of on-chip memory reduces the need for external memory in many designs, simplifying board-level BOM.
• Ample I/O: 256 I/O pins support complex connectivity and high signal-count designs on a single package.
• Compact surface-mount package: 676-FCBGA (27×27) package provides a dense, manufacturable footprint for space-constrained boards.
• Extended-grade temperature: Specified for 0 °C to 100 °C operation to meet a range of thermal environments within that window.
• RoHS compliant: Built to satisfy RoHS environmental compliance requirements.

Why Choose XCKU3P-2FFVA676E?

The XCKU3P-2FFVA676E combines a high count of logic elements, substantial embedded memory, and plentiful I/O in a single 676-FCBGA surface-mount package, offering a compact, integration-friendly FPGA option. Its extended-grade temperature rating and RoHS compliance make it suitable for deployments that operate within the specified thermal and environmental parameters.

This device is suited to designers seeking a scalable, high-capacity programmable logic element with on-chip RAM and a dense pinout for complex board-level integration. Its electrical and thermal specifications support consistent behavior within the stated operating ranges.

Request a quote or submit a pricing inquiry to obtain availability and ordering information for the XCKU3P-2FFVA676E.