XCKU3P-L2FFVB676E

The XCKU3P-L2FFVB676E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD, delivered in a 676-ball FCBGA package (27×27). It combines high logic density, substantial on-chip memory, and a wide I/O count to support complex, integrated digital designs.

With 355,950 logic elements, approximately 31.6 Mbits of embedded memory, and 280 user I/O, this extended-grade device targets applications that require significant programmable logic, memory resources, and flexible I/O in a surface-mount FCBGA package.

Key Features

• Core Logic  355,950 logic elements organized across 20,340 CLBs for implementing large, configurable digital logic designs.
• Embedded Memory  Approximately 31.6 Mbits of on-chip RAM to support buffering, frame storage, and algorithmic state.
• I/O Capacity  280 user I/O pins to interface with peripherals, transceivers, and external devices in high-connectivity systems.
• Power Supply  Operates from 698 mV to 876 mV supply rails, enabling integration into designed power domains.
• Package & Mounting  676-ball FCBGA (27×27) package intended for surface-mount assembly in board-level designs.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0 °C to 100 °C for deployment across a range of commercial and extended-temperature environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density logic and control  Implement complex control and processing functions using the device's 355,950 logic elements and 20,340 CLBs.
• Data buffering and on-chip storage  Leverage approximately 31.6 Mbits of embedded memory for frame buffers, FIFOs, and temporary data storage.
• Multi-channel I/O systems  Use the 280 I/O pins to connect to multiple sensors, peripherals, or external interfaces in densely connected designs.
• Board-level integration  The 676-FCBGA surface-mount package supports compact, high-pin-count board layouts where package density matters.

Unique Advantages

• High logic capacity: 355,950 logic elements enable implementation of large-scale programmable functions without external logic.
• Significant embedded memory: Approximately 31.6 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Generous I/O resources: 280 I/O pins offer flexibility for multi-channel interfacing and board-level connectivity.
• Compact, manufacturable package: 676-FCBGA (27×27) surface-mount package provides a high-pin-count solution suitable for dense PCB designs.
• Extended-grade operation: Rated for 0 °C to 100 °C, matching applications that require extended commercial temperature operation.
• Low-voltage operation: Supported supply range (698 mV to 876 mV) accommodates low-voltage power domains in modern systems.

Why Choose XCKU3P-L2FFVB676E?

The XCKU3P-L2FFVB676E positions itself as a high-capacity, integrated FPGA option for designs demanding large programmable logic, substantial on-chip memory, and broad I/O in a compact FCBGA package. Its extended-grade operating temperature and RoHS compliance make it suitable for applications that require reliable operation across a wide ambient range while meeting environmental regulations.

Choose this device when your design requires a balance of logic density, memory resources, and I/O flexibility in a surface-mount 676-ball FCBGA package—delivering a scalable hardware platform for complex, board-level FPGA implementations.

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