XCKU5P-1FFVB676E

The XCKU5P-1FFVB676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, provided in a 676-FCBGA (27×27) surface-mount package. It delivers a high logic capacity and on-chip memory suitable for complex, programmable digital designs.

With 474,600 logic elements, approximately 42 Mbits of embedded RAM, and up to 280 I/O, this extended-grade device (0 °C to 100 °C) is targeted at applications that require substantial programmable logic, significant embedded memory, and dense I/O integration while operating from a supply range of 825 mV to 876 mV.

Key Features

• Logic Capacity 474,600 logic elements for implementing large, complex digital designs and custom hardware functions.
• Embedded Memory Approximately 42 Mbits of on-chip RAM to support memory-intensive logic and buffering requirements.
• I/O Count Up to 280 configurable I/O pins to interface with multiple peripherals and system buses.
• Power Supply Operates within a supply range of 825 mV to 876 mV to match specific low-voltage system domains.
• Package and Mounting 676-BBGA, FCBGA package (supplier package: 676-FCBGA, 27×27) in a surface-mount form factor for compact PCB integration.
• Temperature and Grade Extended-grade device rated for operation from 0 °C to 100 °C.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High-density digital systems Use where large amounts of programmable logic are required to implement custom processing, control, or glue-logic functions.
• Memory-intensive designs Embedded RAM capacity supports on-chip buffering, look-up tables, and data-path storage for complex algorithms.
• I/O-rich platforms Systems that require many external interfaces and signals can leverage the device’s up to 280 I/O pins for broad connectivity.

Unique Advantages

• High logic integration: 474,600 logic elements enable consolidation of multiple functions into a single device, simplifying board-level design.
• Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces reliance on external memory for many buffering and processing tasks.
• Generous I/O capacity: Up to 280 I/O pins support complex peripheral connectivity without extensive external multiplexing.
• Compact, surface-mount package: 676-FCBGA (27×27) provides a high-pin-count solution in a compact footprint for space-constrained designs.
• Extended operating range: Rated for 0 °C to 100 °C operation to meet a wide set of commercial and extended-temperature application needs.
• RoHS compliant: Conforms to RoHS requirements for materials and lead-free manufacturing considerations.

Why Choose XCKU5P-1FFVB676E?

The XCKU5P-1FFVB676E combines high logic element density, substantial embedded RAM, and extensive I/O in a compact 676-FCBGA surface-mount package. Its extended-grade temperature range and defined low-voltage supply make it suitable for designs that require significant programmable resources while operating within precise power and thermal envelopes.

This Kintex® UltraScale+™ device is appropriate for engineers and procurement teams building scalable, logic- and memory-intensive systems who need a high-capacity FPGA option from AMD’s Kintex UltraScale+ family.

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