XCKU5P-2FFVB676E

The XCKU5P-2FFVB676E is a Kintex UltraScale+ field programmable gate array (FPGA) IC offering high logic density and substantial embedded memory in a 676‑ball FCBGA package. It targets applications that require large programmable logic capacity, significant on‑chip RAM, and a high count of I/O in a surface‑mount FCBGA form factor.

Key value comes from its combination of approximately 474,600 logic elements, roughly 42 Mbits of embedded memory, and 280 I/O pins, along with an extended operating temperature range and low-voltage core supply.

Key Features

• Core Logic  Approximately 474,600 logic elements and 27,120 CLBs provide substantial capacity for complex programmable logic and custom hardware functions.
• Embedded Memory  Total on‑chip RAM of 41,984,000 bits (approximately 42 Mbits) supports memory‑intensive designs and local buffering without external memory.
• I/O  280 I/O pins accommodate a wide range of peripheral interfaces and high‑pin‑count connectivity requirements.
• Power  Core voltage supply specified at 825 mV to 876 mV for low‑voltage operation and power planning.
• Package & Mounting  676‑ball FCBGA (676‑FCBGA, 27×27) surface‑mount package for dense board integration and thermal/proximity planning.
• Temperature & Grade  Extended grade operation from 0°C to 100°C to match designs requiring a wider ambient operating range.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High‑density logic systems  Implement complex custom logic, protocol bridges, and hardware acceleration within a single FPGA fabric.
• Memory‑intensive designs  Use the approximately 42 Mbits of embedded RAM for buffering, packet processing, and local data storage.
• High‑I/O interface platforms  Leverage 280 I/O pins for multi‑lane interfaces, sensor arrays, or dense peripheral connectivity.

Unique Advantages

• High logic density: Approximately 474,600 logic elements enable consolidation of multiple functions into a single device, simplifying board-level design.
• Significant on‑chip memory: Roughly 42 Mbits of embedded RAM reduce reliance on external memory and improve latency for data‑critical tasks.
• Generous I/O count: 280 I/Os provide flexibility for complex system interconnects and high‑pin‑count designs.
• Compact FCBGA package: 676‑ball FCBGA (27×27) allows dense board integration while supporting necessary signal routing and board layout strategies.
• Extended temperature operation: 0°C to 100°C rating supports deployments that require broader ambient tolerance than standard commercial ranges.
• RoHS compliant: Conforms to common environmental standards for manufacturing and assembly.

Why Choose XCKU5P-2FFVB676E?

The XCKU5P-2FFVB676E positions itself as a high‑capacity FPGA option that combines large programmable logic resources, substantial embedded memory, and a high I/O count in a compact 676‑ball FCBGA surface‑mount package. Its extended temperature rating and low‑voltage core supply make it suitable for designs requiring robust on‑board integration and predictable power planning.

This device is well suited to engineers and procurement teams looking to consolidate complex functions onto a single FPGA, reduce external component count, and maintain a compact board footprint while meeting extended ambient requirements.

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