XCKU5P-2SFVB784E

The XCKU5P-2SFVB784E is a Kintex® UltraScale+™ FPGA IC that delivers a substantial logic and memory footprint in a 784-ball FCBGA package. It combines a large number of logic elements, on-chip RAM, and a high I/O count to support complex, custom digital designs.

Key device attributes include 474,600 logic elements, approximately 42 Mbits of embedded memory, 304 I/O, an extended grade operating range of 0 °C to 100 °C, and a supply range of 825 mV to 876 mV — enabling compact, high-density implementations where these electrical and thermal conditions match design requirements.

Key Features

• Core Logic Capacity 474,600 logic elements provide a large fabric for implementing custom digital logic, algorithms, and glue logic within a single device.
• Embedded Memory Approximately 42 Mbits of on-chip RAM support buffering, state storage, and local data processing without external memory for many use cases.
• I/O Density 304 general-purpose I/O pins enable broad interfacing to peripherals, sensors, and external subsystems.
• Power Supply Range Operates with a core supply range of 825 mV to 876 mV, allowing designs to target the specified voltage envelope.
• Package & Mounting Supplied in a 784‑FCBGA package (23×23) for surface-mount PCB assembly, providing a compact footprint for high-density boards.
• Operating Grade & Temperature Extended grade with an operating temperature range of 0 °C to 100 °C to meet applications requiring elevated-temperature operation within that window.
• Environmental Compliance RoHS compliant, meeting common regulatory requirements for lead-free assembly.

Typical Applications

• Custom Digital Processing — Use the device's 474,600 logic elements and embedded memory to implement bespoke datapaths, accelerators, and control logic tailored to specific system requirements.
• Memory-Intensive Functions — Approximately 42 Mbits of on-chip RAM supports local buffering, queueing, and state machines without immediate reliance on external memory.
• High‑Pin-Count Interfaces — The 304 I/O pins facilitate integration with multiple peripherals, sensors, and I/O boards where numerous signals are required.
• Compact System Integration — The 784‑FCBGA (23×23) surface-mount package enables dense PCB layouts for space-constrained designs that require substantial logic and I/O.

Unique Advantages

• Large Logic Resource: 474,600 logic elements allow extensive on-chip implementation of complex logic, reducing the need for multiple devices.
• Significant Embedded Memory: Approximately 42 Mbits of RAM supports local data handling and reduces dependency on external memory subsystems.
• Extensive I/O: 304 I/O pins provide flexibility for interfacing with a wide range of external components and systems.
• Compact FCBGA Package: The 784‑ball FCBGA (23×23) offers a high-density form factor suitable for tightly-packed board designs.
• Extended Operating Range: Rated for 0 °C to 100 °C operation, matching applications that require above-typical commercial temperature tolerance within that range.
• RoHS Compliant: Meets lead-free assembly requirements for environmentally conscious production.

Why Choose XCKU5P-2SFVB784E?

The XCKU5P-2SFVB784E positions itself as a high-capacity, on-chip resource for designs that need substantial logic, embedded memory, and broad I/O in a compact FCBGA package. Its combination of 474,600 logic elements, approximately 42 Mbits of embedded RAM, and 304 I/O pins makes it well suited to consolidate complex functions into a single programmable device while operating within a defined 825 mV–876 mV supply range and 0 °C–100 °C temperature window.

This device is appropriate for engineering teams and procurement seeking a programmable IC with large on-chip resources, a dense package footprint (784‑FCBGA, 23×23), and extended-grade operating specifications for applications aligned with the stated electrical and thermal limits.

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