XCKU5P-L1FFVB676I

The XCKU5P-L1FFVB676I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD supplied in a 676-ball FCBGA package. It combines a very large logic capacity with substantial embedded memory and extensive I/O to support complex, high-density digital designs.

With 474,600 logic elements, approximately 42 Mbits of embedded memory and 280 I/O pins, this industrial-grade FPGA is well suited for designs that require large programmable fabric, significant on-chip storage and broad external interfacing while operating across a wide supply and temperature range.

Key Features

• Logic Capacity  Approximately 474,600 logic elements to implement complex digital logic, custom accelerators and programmable datapaths.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM for buffering, FIFOs and local data storage close to logic.
• I/O Resources  280 user I/O pins to support diverse external interfaces and high pin-count connectivity.
• Package  676-ball FCBGA package (676-FCBGA, 27×27) providing a high-density mounting footprint for board-level integration.
• Power Supply Range  Operates from 698 mV to 876 mV supply rails, enabling integration into low-voltage system power domains.
• Temperature and Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for use in temperature-challenging environments.
• Mounting  Surface-mount device for standard PCB assembly processes.
• Regulatory  RoHS compliant.

Typical Applications

• Signal Processing and Acceleration  Implements high-density custom datapaths and on-chip memory buffering for real-time signal processing tasks.
• Network and Communication Systems  Provides large logic resources and plentiful I/O for protocol handling, packet processing and interface bridging.
• Industrial Control and Automation  Offers industrial-grade temperature tolerance and ample logic to implement complex control algorithms and I/O aggregation.
• Embedded System Prototyping  Serves as a scalable programmable fabric for developing and validating system-level functions with significant on-chip memory and I/O.

Unique Advantages

• High Logic Density:  Approximately 474,600 logic elements enable large, consolidated designs that reduce the need for multiple devices.
• Substantial On-Chip Memory:  Around 42 Mbits of embedded RAM supports local data storage and reduces external memory bandwidth requirements.
• Extensive I/O Count:  280 I/O pins give flexibility to interface with multiple peripherals and high-pin-count connectors.
• Industrial Temperature Range:  Rated from −40 °C to 100 °C for deployment in temperature-demanding applications.
• Compact, High-Density Package:  676-ball FCBGA (27×27) enables high-pin-count routing in a compact board footprint.
• RoHS Compliant:  Meets common material compliance requirements for modern electronics manufacturing.

Why Choose XCKU5P-L1FFVB676I?

The XCKU5P-L1FFVB676I delivers a combination of high logic capacity, significant embedded memory and ample I/O in a compact 676-ball FCBGA package, tailored for designs that demand dense programmable logic and on-chip storage. Its industrial operating range and RoHS compliance make it suitable for long-term deployment in temperature-challenging and regulated environments.

This device is a strong option for engineering teams building complex signal processing, communication or industrial control systems that require scalability, integration and reliable operation supported by the Kintex UltraScale+ family architecture.

Request a quote or submit an inquiry to receive pricing and availability for the XCKU5P-L1FFVB676I and to discuss how this FPGA can meet your project requirements.