XCKU5P-L2FFVA676E

The XCKU5P-L2FFVA676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC offered in a 676-ball FCBGA package. It integrates substantial programmable logic, on-chip memory and a broad I/O count to address designs that require large logic capacity and significant embedded RAM.

Key device metrics include 474,600 logic elements, approximately 42 Mbits of embedded memory, and 256 user I/O lines, combined with an extended-grade operating range and a compact 676-FCBGA (27×27 mm) surface-mount package.

Key Features

• Logic Capacity  Provides 474,600 logic elements to implement complex digital designs and large-scale programmable functions.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM for buffering, algorithm acceleration and data storage within the FPGA fabric.
• I/O Resources  256 user I/O pins to support multiple parallel interfaces and high-density board-level connectivity.
• Power Supply Range  Operates with a core voltage supply range of 698 mV to 876 mV, enabling integration into regulated power domains.
• Package & Mounting  676-ball FCBGA package (676-FCBGA, 27×27 mm) in a surface-mount form factor for compact board designs.
• Operating Conditions  Extended-grade device with an operating temperature range of 0 °C to 110 °C, suitable for many demanding system environments.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing and regulatory compatibility.

Typical Applications

• High-density digital systems  Use the device to implement large-scale programmable logic where many gates and embedded RAM are required.
• Data buffering and on-chip processing  Leverage approximately 42 Mbits of embedded memory for local data storage, packet buffering or intermediate compute tasks.
• Multi-interface boards  Take advantage of 256 I/O lines to connect multiple high-pin-count peripherals or parallel interfaces on a single FPGA.

Unique Advantages

• Large programmable fabric  474,600 logic elements allow consolidation of functions that might otherwise require multiple devices.
• Significant on-chip RAM  Approximately 42 Mbits of embedded memory reduces dependence on external memory for many buffering and caching needs.
• Ample I/O  256 I/O pins provide flexibility for system partitioning and high-pin-count interconnects without external multiplexing.
• Compact FCBGA package  676-ball 27×27 mm FCBGA offers high integration density in a surface-mount form factor suitable for space-constrained PCBs.
• Extended operating range  0 °C to 110 °C rating and extended-grade classification support deployment in environments requiring broader temperature tolerance.
• RoHS compliance  Meets environmental manufacturing standards for lead-free assembly.

Why Choose XCKU5P-L2FFVA676E?

The XCKU5P-L2FFVA676E balances substantial logic capacity, on-chip memory and generous I/O resources within a compact 676-FCBGA surface-mount package. Its extended-grade temperature range and RoHS compliance make it suitable for systems that require robust thermal operation and regulatory compatibility.

This device is well suited to engineers and procurement teams designing high-density programmable systems that need integrated memory and many I/O lines, offering a scalable platform for complex digital implementations.

If you would like pricing, availability or to request a quote for XCKU5P-L2FFVA676E, submit a request or contact sales for more information.