XCKU9P-1FFVE900E

The XCKU9P-1FFVE900E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides high logic capacity and substantial embedded memory in a 900-FCBGA (31×31) surface-mount package, suitable for designs that require large on-chip resources and significant I/O count.

Key device characteristics include approximately 599,550 logic elements, roughly 41.9 Mbits of embedded memory, 304 I/O pins, and an operating supply range of 825 mV to 876 mV, with an operating temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity  Approximately 599,550 logic elements providing high-density programmable logic; includes 34,260 configurable logic blocks (CLBs) for partitioning and design organization.
• Embedded Memory  Approximately 41.9 Mbits of on-chip RAM to support buffering, packet processing, or intermediate data storage without external memory.
• I/O and Package  304 I/O pins in a 900-FCBGA (31×31) supplier device package, delivered as a surface-mount component for compact board integration.
• Power  Designed to operate from a core supply range of 825 mV to 876 mV, enabling consistent core voltage targeting across system designs.
• Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for applications within this thermal envelope.
• Regulatory Compliance  RoHS compliant for conformity with common materials and environmental preferences.

Unique Advantages

• High on-chip logic density: Approximately 599,550 logic elements enable implementation of complex, large-scale digital designs within a single FPGA.
• Substantial embedded memory: Nearly 41.9 Mbits of RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Generous I/O count: 304 I/O pins provide flexibility for interfacing to multiple peripherals, mezzanine cards, or high-pin-count connectors.
• Compact, manufacturable package: 900-FCBGA (31×31) surface-mount package supports dense PCB layouts while maintaining robust attachment for automated assembly.
• Defined operating envelope: Specified core supply range (825 mV–876 mV) and operating temperature (0 °C–100 °C) allow precise system-level power and thermal planning.

Why Choose XCKU9P-1FFVE900E?

The XCKU9P-1FFVE900E delivers a combination of high logic capacity, sizable embedded memory, and ample I/O in a 900-FCBGA surface-mount package, making it well suited for designs that require consolidated programmable logic and on-chip resources. Its extended-grade temperature range and defined core voltage range support consistent integration into systems whose thermal and power characteristics fall within the specified limits.

This part is appropriate for development teams and procurement seeking a high-density Kintex® UltraScale+™ FPGA from AMD, offering a measurable set of on-chip resources and package characteristics that simplify board-level planning and component selection.

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