XCKU9P-2FFVE900E

IC FPGA 304 I/O 900FCBGA
Part Description

Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 304 41881600 599550 900-BBGA, FCBGA

Quantity 56 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package900-FCBGA (31x31)GradeExtendedOperating Temperature0°C – 100°C
Package / Case900-BBGA, FCBGANumber of I/O304Voltage825 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs34260Number of Logic Elements/Cells599550
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41881600

Overview of XCKU9P-2FFVE900E – Kintex® UltraScale+™ FPGA, 900-FCBGA

The XCKU9P-2FFVE900E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 900-FCBGA surface-mount package. It delivers high programmable logic capacity and substantial on-chip memory for complex digital designs.

Key hardware characteristics include 599,550 logic elements, approximately 41.9 Mbits of embedded memory, 304 user I/Os, and a defined supply voltage window of 825 mV to 876 mV, all packaged in a 900-FCBGA (31×31) form factor with an extended operating grade.

Key Features

  • Core Logic  599,550 logic elements provide high-density programmable logic resources for large designs.
  • Embedded Memory  Total on-chip RAM equals 41,881,600 bits (approximately 41.9 Mbits) for local storage and buffering.
  • I/O Resources  304 user I/O pins to support broad interfacing and parallel connectivity needs.
  • Power Supply  Defined voltage supply range from 825 mV to 876 mV for predictable power design and supply planning.
  • Package & Mounting  900-FCBGA (31×31) / 900-BBGA package in a surface-mount configuration for compact board-level integration.
  • Operating Range & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.

Unique Advantages

  • High logic density: 599,550 logic elements consolidate complex functions into a single device, reducing multi-device BOM and board complexity.
  • Significant embedded RAM: Approximately 41.9 Mbits of on-chip memory reduce dependence on external memory for many buffering and working-set requirements.
  • Ample I/O count: 304 I/Os simplify system integration by providing numerous connections for peripherals, sensors, and board-level signals.
  • Compact, high-pin package: The 900-FCBGA (31×31) package enables high-density PCB layouts while maintaining large I/O and logic capacity.
  • predictable power requirements: A narrow supply voltage window (825–876 mV) supports precise power budgeting for system designers.
  • Extended operating grade: Rated for 0 °C to 100 °C operation, suitable for a range of standard operating environments.

Why Choose XCKU9P-2FFVE900E?

The XCKU9P-2FFVE900E is positioned for designs that require a combination of very high programmable logic capacity, substantial embedded memory, and broad I/O capability in a compact FCBGA package. Its specified supply range and extended operating grade make it a predictable choice for boards optimized for performance and density.

This FPGA is suitable for engineering teams and procurement seeking a single-device solution that consolidates logic, memory, and I/O to simplify system design and reduce component count while maintaining explicit, verifiable hardware specifications.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU9P-2FFVE900E.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up