XCKU5P-L2SFVB784E

The XCKU5P-L2SFVB784E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) manufactured by AMD. It provides a large programmable-logic resource set, significant on-chip RAM, and a high pin-count BGA package for complex embedded designs.

Key device metrics include 474,600 logic elements, approximately 42 Mbits of embedded memory, and 304 I/O pins. The device is supplied in a 784-FCBGA (23×23) package, supports a supply range of 698 mV to 876 mV, and is rated for an operating temperature range of 0°C to 110°C (Extended grade).

Key Features

• Logic Capacity — 474,600 logic elements provide the programmable fabric required for large-scale logic integration and complex algorithm implementation.
• Embedded Memory — Approximately 42 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data storage without external memory for many functions.
• I/O Density — 304 user I/O pins enable extensive interfacing with peripherals, sensors, and external devices in high-density designs.
• Package — 784-BFBGA / 784-FCBGA (23×23) surface-mount package for high-pin-count board-level integration.
• Power — Operates across a supply range of 698 mV to 876 mV to match system power-rail requirements.
• Temperature & Grade — Extended-grade device rated for 0°C to 110°C operating temperature, suited for applications requiring beyond-commercial temperature range support.
• Mounting — Surface-mount package compatible with standard PCB assembly processes for BGA components.

Typical Applications

• High-capacity programmable logic — Use the device's 474,600 logic elements to implement large custom datapath, control logic, or protocol processing blocks.
• Embedded memory-centric designs — Approximately 42 Mbits of on-chip RAM can be applied to packet buffering, frame storage, or LUT-based processing without immediate dependence on external memory.
• High-pin-count system interfaces — 304 I/O pins enable connectivity to multiple high-speed interfaces, dense sensor arrays, or extensive peripheral sets.
• Board-level integration — The 784-FCBGA (23×23) surface-mount package supports compact, high-density PCB layouts for space-constrained applications.

Unique Advantages

• Large logic resource — 474,600 logic elements allow consolidation of multiple functions into a single FPGA, reducing component count and BOM complexity.
• Substantial on-chip memory — Approximately 42 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs, improving system responsiveness.
• High I/O capacity — 304 I/Os enable flexible partitioning of signals and extensive peripheral connectivity without external multiplexing.
• Compact high-density package — The 784-FCBGA (23×23) package delivers high pin-count in a compact surface-mount form factor for modern PCB designs.
• Operational range — Extended-grade rating and 0°C to 110°C operating temperature support deployments that require wider-than-standard commercial temperature tolerance.
• Defined supply window — A specified supply range of 698 mV to 876 mV enables clear power-system design and sequencing considerations.

Why Choose XCKU5P-L2SFVB784E?

The XCKU5P-L2SFVB784E combines a very large logic fabric, significant on-chip memory, and high I/O count in a 784-FCBGA surface-mount package. Its extended-grade temperature rating and defined supply range make it a strong option for designs requiring substantial programmable resources and reliable operation across a broader temperature range.

This device is well suited for engineering teams targeting complex, integrated FPGA implementations where consolidation of logic and memory resources on-chip simplifies board-level design and helps manage system-level complexity.

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