XCKU5P-L1SFVB784I

The XCKU5P-L1SFVB784I is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-capacity programmable fabric with a large number of logic elements, significant on-chip memory, and a broad I/O count suitable for dense integration into system designs.

Targeted at industrial applications, this surface-mount FCBGA device combines substantial logic resources, approximately 42 Mbits of embedded memory, and an industrial operating temperature range to address demanding design requirements where integration and reliability matter.

Key Features

• Kintex UltraScale+ FPGA Architecture  Industry-grade FPGA fabric from AMD in a Kintex® UltraScale+™ family device.
• Logic Capacity  474,600 logic elements to implement large-scale custom logic and complex designs.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM for data buffering, FIFO structures, and local storage.
• I/O  304 user I/O pins for interfacing with multiple peripherals, buses, and sensors.
• Power  Specified core supply range from 698 mV to 876 mV.
• Package & Mounting  784-BFBGA FCBGA package (784-FCBGA, 23×23) in a surface-mount format for compact board integration.
• Temperature & Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Custom digital processing  Implement complex, application-specific logic using the device's 474,600 logic elements for algorithm acceleration and protocol handling.
• Memory-intensive buffering  Use approximately 42 Mbits of embedded RAM for data buffering, streaming FIFOs, and intermediate storage within data paths.
• I/O aggregation and interface bridging  Leverage 304 I/O pins to consolidate multiple peripheral interfaces or implement protocol bridging on a single device.
• Industrial control and automation  Deploy in industrial environments where the device's -40 °C to 100 °C operating range and industrial grade are required.

Unique Advantages

• High logic density: 474,600 logic elements allow complex designs to be implemented without external programmable logic.
• Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces the need for external memory in many buffering and streaming applications.
• Extensive I/O capability: 304 I/O pins enable broad peripheral connectivity and flexible board-level partitioning.
• Industrial temperature rating: Operates across -40 °C to 100 °C, supporting deployments in demanding thermal environments.
• Compact, manufacturable package: 784-FCBGA (23×23) surface-mount package supports high-density PCB layouts and automated assembly.
• RoHS compliance: Meets environmental requirements for lead-free production processes.

Why Choose XCKU5P-L1SFVB784I?

The XCKU5P-L1SFVB784I balances high logic capacity, sizeable embedded memory, and a large I/O count in a compact FCBGA package, making it well suited for engineers developing integrated, performance-oriented FPGA-based systems. Its industrial temperature rating and RoHS compliance support deployments where environmental robustness and regulatory conformance are important.

As a Kintex® UltraScale+™ device from AMD, this FPGA is positioned for designs that require substantial on-chip resources and reliable operation across a wide temperature range while maintaining a compact board footprint.

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