XCKU5P-2SFVB784I

The XCKU5P-2SFVB784I is an AMD Kintex® UltraScale+™ field programmable gate array (FPGA) in a 784-ball FCBGA package. It delivers high logic capacity and substantial on-chip memory for complex, programmable digital designs.

Key device highlights include 474,600 logic elements, approximately 42 Mbits of embedded RAM, 304 user I/O pins, an industrial operating temperature range, and low-voltage core operation—features that support dense, performance-oriented system designs.

Key Features

• Core Logic  Provides 474,600 logic elements suitable for large, highly parallel digital designs.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, caches, and state storage without external memory.
• I/O and Package  304 user I/O pins in a 784-FCBGA package (supplier device package: 784-FCBGA, 23×23) in a surface-mount form factor for board-level integration.
• Power  Core supply voltage range specified at 825 mV to 876 mV for low-voltage operation.
• Thermal and Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for temperature‑sensitive applications.
• Mounting and Package Case  Surface mount device in a 784-BFBGA/FCBGA package case for compact system designs.

Typical Applications

• High-density FPGA designs  Suitable where large logic capacity (474,600 logic elements) is required to implement complex algorithms or large-scale custom logic.
• On-chip memory–centric designs  Useful for systems needing significant embedded RAM (approximately 42 Mbits) for buffering, packet processing, or temporary data storage.
• High I/O count systems  Well suited to designs that require many external interfaces thanks to 304 user I/O pins in a compact FCBGA package.

Unique Advantages

• High logic capacity: 474,600 logic elements enable dense, feature-rich implementations without immediately resorting to multiple devices.
• Substantial embedded memory: Approximately 42 Mbits of on-chip RAM reduces reliance on external memory and simplifies board-level BOM.
• Generous I/O resources: 304 user I/Os provide flexibility for interfacing with multiple peripherals, sensors, and high-speed links.
• Industrial temperature range: −40 °C to 100 °C operation supports deployments in thermally demanding environments.
• Compact FCBGA package: 784-ball surface-mount FCBGA (23×23) balances I/O density with a small PCB footprint for space-constrained designs.
• Low-voltage core operation: 825–876 mV supply range for the core supports power-sensitive architectures and efficient power budgeting.

Why Choose XCKU5P-2SFVB784I?

The XCKU5P-2SFVB784I positions itself as a high-capacity, industrial-grade FPGA option within the Kintex UltraScale+ family, combining a large logic fabric, significant embedded memory, and abundant I/O in a compact 784-FCBGA package. Its operating and power specifications make it a fit for demanding, temperature-variable applications that require substantial on-chip resources.

This device is suited to engineering teams building complex programmable systems that need scalability, dense integration, and robust temperature performance while minimizing external memory and I/O compromises.

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