XCKU5P-2FFVD900I

The XCKU5P-2FFVD900I is a Kintex® UltraScale+™ field programmable gate array (FPGA) IC supplied in a 900-ball FCBGA package. It provides a combination of high logic capacity, substantial embedded memory, and a large I/O count in a compact surface-mount package for industrial applications.

Designed for systems that require dense programmable logic, on-chip memory and robust I/O, this device supports designs operating across an industrial temperature range and within a low-voltage supply window.

Key Features

• Core Capacity — 474,600 logic elements and 27,120 logic blocks provide extensive programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 42 Mbits of on-chip RAM to support buffering, lookup tables and intermediate data storage.
• I/O Resources — 304 user I/O pins to interface with peripherals, data converters and external memory or logic.
• Package & Mounting — 900-ball BGA (900-FCBGA, 31×31) in a surface-mount form factor for high-density board integration.
• Power — Operates from a supply range of 825 mV to 876 mV, suitable for designs targeting this core-voltage window.
• Thermal & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance — RoHS-compliant for lead-free manufacturing and environmental compliance requirements.

Typical Applications

• High-density digital processing — Use the large logic element count to implement complex logic functions, custom accelerators and protocol engines.
• Signal and data buffering — Approximately 42 Mbits of embedded RAM supports packet buffering, FIFOs and intermediate data storage for real-time processing.
• Industrial control & automation — Industrial temperature rating and robust I/O make this FPGA suitable for control logic, motor drives and supervisory systems.
• Communications infrastructure — 304 I/O pins enable high-density interfacing for backplane, fronthaul or aggregation functions where programmable logic is needed.

Unique Advantages

• High logic density: 474,600 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Substantial on-chip memory: Approximately 42 Mbits of RAM reduces reliance on external memory for many buffering and data-path tasks.
• Significant I/O capability: 304 I/O pins allow flexible interfacing with peripherals, sensors and external systems without immediate need for expansion devices.
• Industrial temperature support: Rated from −40 °C to 100 °C for reliable operation in industrial environments.
• Compact high-pin-count package: The 900-FCBGA (31×31) package delivers high integration density in a surface-mount form factor suitable for space-constrained boards.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose XCKU5P-2FFVD900I?

The XCKU5P-2FFVD900I positions itself as a high-capacity FPGA option that balances large programmable logic resources, significant embedded memory and a broad I/O complement within a compact 900-FCBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for long-lived, environmentally conscious designs.

This device is suited to engineers and system designers looking to consolidate functions, implement advanced digital processing or create flexible I/O-rich platforms while maintaining small board footprint and industrial operating range.

Request a quote or submit a pricing and availability inquiry for the XCKU5P-2FFVD900I to move your design forward.