XCKU5P-2FFVD900E

The XCKU5P-2FFVD900E is a Kintex® UltraScale+™ field programmable gate array from AMD delivering high digital integration in a 900-ball FCBGA package. It provides substantial logic capacity and on-chip memory with a large complement of I/O, designed for systems that require dense programmable logic and embedded RAM resources.

Key measurable attributes include 474,600 logic elements, approximately 42 Mbits of embedded memory, and 304 I/O pins. The device is surface-mount packaged in a 900-FCBGA (31×31) and is graded as Extended with an operating temperature range of 0 °C to 100 °C.

Key Features

• Core Logic Capacity 474,600 logic elements for high-density digital design and complex logic implementation.
• Embedded Memory Approximately 42 Mbits of on-chip RAM to support memory-intensive functions and buffering.
• High I/O Count 304 user I/O pins to support multiple interfaces and high-pin-count system connectivity.
• Package 900-ball FCBGA (900-FCBGA, 31×31) surface-mount package for compact board-level integration.
• Power Supply Range Core voltage specified from 825 mV to 876 mV to match system power design requirements.
• Thermal and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C for extended-environment applications.
• RoHS Compliant Device meets RoHS requirements for reduced hazardous substances.

Typical Applications

• High-density logic implementations Use the large logic capacity for complex FPGA designs requiring significant combinational and sequential resources.
• Memory-intensive processing On-chip RAM supports buffering, packet processing, and other applications that need embedded memory close to logic.
• Multi-interface systems The 304 I/O pins enable integration with a variety of external peripherals and high-pin-count subsystems.

Unique Advantages

• Large integrated logic 474,600 logic elements help reduce the need for multiple components and simplify system architecture.
• Substantial on-chip memory Approximately 42 Mbits of embedded RAM lowers external memory dependence and improves data throughput within the FPGA fabric.
• High I/O density 304 I/Os provide flexibility for routing many signals or multiple interfaces from a single device.
• Compact packaging 900-FCBGA (31×31) surface-mount package enables high-density board layouts while supporting robust connectivity.
• Extended operating range Extended grade and 0 °C to 100 °C operation address broader-environment deployment needs.
• Regulatory compliance RoHS compliance supports environmental and manufacturing requirements.

Why Choose XCKU5P-2FFVD900E?

The XCKU5P-2FFVD900E positions itself as a high-capacity, memory-rich FPGA option in a compact FCBGA package, suitable for designs that demand significant programmable logic, embedded RAM, and a large number of I/Os. Its specification set—474,600 logic elements, approximately 42 Mbits of on-chip RAM, 304 I/Os, and a 900-ball FCBGA footprint—offers a clear platform for consolidating functionality and simplifying board-level integration.

Backed by AMD manufacturing, this Extended grade device provides a balance of performance and integration for engineering teams focused on scalable FPGA implementations and robust system designs.

Request a quote or submit your requirements today to receive pricing and availability information for the XCKU5P-2FFVD900E.