XCKU5P-2FFVB676I

The XCKU5P-2FFVB676I from AMD is a Kintex® UltraScale+™ field-programmable gate array (FPGA) IC designed for industrial applications. It provides a high logic capacity and on-chip memory in a compact 676‑FBGA (27×27) package, supporting designs that require dense programmable logic, substantial embedded memory, and a moderate I/O count.

With industrial temperature grading and a low-voltage supply range, this device targets systems where reliable operation across a wide temperature range and efficient power domains are important design considerations.

Key Features

• Core Logic 27,120 configurable logic blocks (CLBs) delivering 474,600 logic elements for complex digital designs.
• Embedded Memory Approximately 42 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• I/O Capacity 280 user I/O pins to interface with peripherals, sensors, and external devices.
• Power Supply Operates from a core voltage supply range of 825 mV to 876 mV to match system power domains.
• Package & Mounting 676‑BBGA (FCBGA) 27×27 package in a surface-mount format for compact PCB integration.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for harsh environments.
• Regulatory Compliance RoHS compliant for environmentally regulated designs.

Typical Applications

• Industrial Control Implement deterministic control logic and custom signal processing while meeting industrial temperature requirements.
• High‑density Logic Systems Deploy where hundreds of thousands of logic elements are required for complex state machines and parallel processing.
• Memory‑intensive FPGA Designs Use the approximately 42 Mbits of embedded memory for buffering, packet processing, or on-chip data storage.

Unique Advantages

• High Logic Density: 474,600 logic elements enable implementation of large, highly parallel logic designs on a single device.
• Substantial On‑chip Memory: Approximately 42 Mbits of RAM reduce reliance on external memory and simplify board-level design.
• Industrial‑grade Operation: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact Surface‑mount Package: 676‑FCBGA (27×27) provides a space-efficient footprint for high-density systems.
• Low‑voltage Core: Operates within an 825 mV to 876 mV supply range to align with modern low-voltage power architectures.
• RoHS Compliant: Environmentally compliant for regulated markets.

Why Choose XCKU5P-2FFVB676I?

The XCKU5P-2FFVB676I combines a high count of logic elements, a large amount of embedded RAM, and an industrial temperature grade in a compact FCBGA package, making it suitable for complex, space-constrained designs that must operate reliably across a wide temperature range. As part of the Kintex® UltraScale+™ family from AMD, it is positioned for customers who need dense programmable logic and integrated memory without sacrificing industrial robustness.

This device is well suited to engineering teams developing advanced control, processing, or interface subsystems that benefit from on-chip memory and high logic capacity, offering a clear pathway to consolidate functionality and reduce external component count.

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