XCKU5P-3SFVB784E

The XCKU5P-3SFVB784E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD provided in a 784-ball FCBGA package. It integrates high logic capacity, substantial on-chip memory, and a large I/O complement for designs that require dense programmable logic and signal interfacing.

This device is offered in an extended grade with surface-mount packaging and supports a supply voltage range of 873 mV to 927 mV and an operating temperature range of 0 °C to 100 °C, enabling deployment in a variety of electronic systems within those environmental limits.

Key Features

• Core Logic  Approximately 355,950 logic elements providing large-scale programmable logic resources.
• Configurable Logic Blocks (CLBs)  20,340 CLBs reported for structured logic partitioning and design mapping.
• Embedded Memory  Approximately 31.6 Mbits of on-chip RAM for buffering, lookup tables and state storage.
• I/O Capacity  304 user I/O pins to support extensive peripheral, memory or interface connectivity.
• Power Supply  Specified core voltage range of 873 mV to 927 mV for power design and sequencing considerations.
• Package & Mounting  784-BFBGA (784-FCBGA, 23×23) surface-mount package for high-density board implementations.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• RoHS Compliance  RoHS compliant for environmental requirement alignment.

Typical Applications

• Programmable logic integration  Use where field-programmable logic and custom hardware acceleration are required, leveraging the device’s large logic element count.
• Memory-intensive designs  Applications that benefit from substantial on-chip RAM for buffering and lookup operations can leverage approximately 31.6 Mbits of embedded memory.
• I/O-dense systems  Systems requiring a high number of external interfaces can take advantage of the device’s 304 I/O pins for extensive connectivity.

Unique Advantages

• High logic capacity:  Approximately 355,950 logic elements enable complex, large-scale programmable implementations without external logic expansion.
• Significant embedded memory:  Roughly 31.6 Mbits of on-chip RAM reduces the need for immediate external memory in many buffering and LUT use cases.
• Extensive I/O:  304 I/O pins provide flexibility for interfacing multiple peripherals, sensors, or high-speed lanes.
• Compact, high-density package:  784-BFBGA / 784-FCBGA (23×23) offers a small footprint for boards where space and pin count must be balanced.
• Environmental and supply clarity:  Extended grade rating and defined supply voltage (873 mV–927 mV) simplify system-level design constraints and validation.
• Regulatory alignment:  RoHS compliance supports adherence to environmental material regulations.

Why Choose XCKU5P-3SFVB784E?

The XCKU5P-3SFVB784E positions itself as a high-capacity Kintex® UltraScale+™ FPGA option that combines a large pool of logic elements, significant embedded memory, and a high I/O count in a compact 784-FCBGA package. Its extended temperature rating and defined supply range provide predictable behavior for systems designed within those limits.

This device is well suited for design teams and procurement looking for a scalable programmable-logic building block that delivers dense logic resources and on-chip memory, while offering the package density and I/O count needed for complex board-level integration.

Request a quote or submit a pricing inquiry to check availability and lead time for XCKU5P-3SFVB784E. Our team can provide product pricing, availability details and support for procurement and design planning.