XCKU5P-L2FFVB676E

IC FPGA 280 I/O 676FCBGA
Part Description

Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 280 41984000 474600 676-BBGA, FCBGA

Quantity 861 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeExtendedOperating Temperature0°C – 110°C
Package / Case676-BBGA, FCBGANumber of I/O280Voltage698 mV - 876 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs27120Number of Logic Elements/Cells474600
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of XCKU5P-L2FFVB676E – Kintex® UltraScale+™ FPGA, 676-FCBGA (27×27)

The XCKU5P-L2FFVB676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides high on-chip logic capacity and embedded memory in a compact 676-ball FCBGA package, with a supply voltage range and an extended operating temperature rating for demanding electronic assemblies.

This device is targeted at system designs that require substantial programmable logic resources, significant embedded RAM, and a sizable I/O count while maintaining surface-mount board assembly compatibility.

Key Features

  • Logic Capacity  474,600 logic elements and 27,120 CLBs, enabling large-scale programmable logic implementations.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM (41,984,000 bits) to support data buffering and intermediate storage.
  • I/O Count  280 general-purpose I/O pins to support diverse external interfaces and peripheral connections.
  • Power and Voltage  Designed for low-voltage operation with a supply range of 698 mV to 876 mV.
  • Package and Mounting  676-BBGA, FCBGA package (supplier device package: 676-FCBGA, 27×27) optimized for surface-mount assembly.
  • Temperature and Grade  Extended grade with an operating temperature range of 0 °C to 110 °C for use in thermally challenging environments.
  • Compliance  RoHS compliant to meet environmental material requirements.

Unique Advantages

  • High logic density: 474,600 logic elements deliver the capacity needed for complex, customized digital functions without external logic.
  • Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
  • Flexible I/O provisioning: 280 I/O pins allow integration with multiple peripherals and interfaces on a single FPGA.
  • Compact FCBGA footprint: 676-ball 27×27 FCBGA package provides a dense, board-friendly form factor for space-constrained designs.
  • Extended operating range: 0 °C to 110 °C rating and extended grade classification support reliable operation in wider temperature environments.
  • Low-voltage operation: 698 mV to 876 mV supply range supports designs targeting reduced core voltage domains.

Why Choose XCKU5P-L2FFVB676E?

The XCKU5P-L2FFVB676E combines large programmable logic resources, significant embedded memory, and a high I/O count in a compact 676-FCBGA package, making it suitable for designs that require integration of extensive custom logic and on-chip data storage. Its extended temperature rating and RoHS compliance support deployment in systems with temperature and environmental considerations.

This FPGA is a practical choice for engineers and procurement teams seeking a high-capacity, surface-mount programmable device from AMD's Kintex UltraScale+ family when on-chip memory, I/O density, and extended-grade operation are primary requirements.

Request a quote or submit an inquiry to receive pricing, availability, and procurement details for the XCKU5P-L2FFVB676E.

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