XCKU5P-L2FFVB676E
| Part Description |
Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC 280 41984000 474600 676-BBGA, FCBGA |
|---|---|
| Quantity | 861 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FCBGA (27x27) | Grade | Extended | Operating Temperature | 0°C – 110°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BBGA, FCBGA | Number of I/O | 280 | Voltage | 698 mV - 876 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 27120 | Number of Logic Elements/Cells | 474600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of XCKU5P-L2FFVB676E – Kintex® UltraScale+™ FPGA, 676-FCBGA (27×27)
The XCKU5P-L2FFVB676E is a Kintex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides high on-chip logic capacity and embedded memory in a compact 676-ball FCBGA package, with a supply voltage range and an extended operating temperature rating for demanding electronic assemblies.
This device is targeted at system designs that require substantial programmable logic resources, significant embedded RAM, and a sizable I/O count while maintaining surface-mount board assembly compatibility.
Key Features
- Logic Capacity 474,600 logic elements and 27,120 CLBs, enabling large-scale programmable logic implementations.
- Embedded Memory Approximately 42 Mbits of on-chip RAM (41,984,000 bits) to support data buffering and intermediate storage.
- I/O Count 280 general-purpose I/O pins to support diverse external interfaces and peripheral connections.
- Power and Voltage Designed for low-voltage operation with a supply range of 698 mV to 876 mV.
- Package and Mounting 676-BBGA, FCBGA package (supplier device package: 676-FCBGA, 27×27) optimized for surface-mount assembly.
- Temperature and Grade Extended grade with an operating temperature range of 0 °C to 110 °C for use in thermally challenging environments.
- Compliance RoHS compliant to meet environmental material requirements.
Unique Advantages
- High logic density: 474,600 logic elements deliver the capacity needed for complex, customized digital functions without external logic.
- Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
- Flexible I/O provisioning: 280 I/O pins allow integration with multiple peripherals and interfaces on a single FPGA.
- Compact FCBGA footprint: 676-ball 27×27 FCBGA package provides a dense, board-friendly form factor for space-constrained designs.
- Extended operating range: 0 °C to 110 °C rating and extended grade classification support reliable operation in wider temperature environments.
- Low-voltage operation: 698 mV to 876 mV supply range supports designs targeting reduced core voltage domains.
Why Choose XCKU5P-L2FFVB676E?
The XCKU5P-L2FFVB676E combines large programmable logic resources, significant embedded memory, and a high I/O count in a compact 676-FCBGA package, making it suitable for designs that require integration of extensive custom logic and on-chip data storage. Its extended temperature rating and RoHS compliance support deployment in systems with temperature and environmental considerations.
This FPGA is a practical choice for engineers and procurement teams seeking a high-capacity, surface-mount programmable device from AMD's Kintex UltraScale+ family when on-chip memory, I/O density, and extended-grade operation are primary requirements.
Request a quote or submit an inquiry to receive pricing, availability, and procurement details for the XCKU5P-L2FFVB676E.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








