XCKU5P-L2FFVD900E

The XCKU5P-L2FFVD900E is a Kintex® UltraScale+™ field programmable gate array (FPGA) from AMD. It provides a high-density programmable fabric with 474,600 logic elements and approximately 42 Mbits of embedded memory, delivered in a 900-FCBGA (31 × 31) package.

This device is intended for designs that need large on-chip memory, substantial logic capacity and a significant number of I/O pins (304), while operating across an extended temperature range and a low-voltage supply envelope.

Key Features

• Core Logic  Approximately 474,600 logic elements to implement complex digital functions and large-scale logic integration.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM for buffering, FIFOs, or lookup tables directly within the FPGA fabric.
• I/O Density  304 I/O pins to support multiple external interfaces and parallel connections without external I/O expansion.
• Package and Mounting  900-BBGA, FCBGA supplier package (900-FCBGA, 31×31) with surface-mount mounting type for high-density PCB designs.
• Power Supply  Supports a core voltage supply range of 698 mV to 876 mV, enabling designs that target this low-voltage operating window.
• Temperature and Grade  Extended grade with an operating temperature range from 0 °C to 110 °C for deployments that require wider-than-commercial temperature tolerance.
• Compliance  RoHS compliant, meeting common lead-free and environmental packaging requirements.

Typical Applications

• High-density digital logic  Implement large combinational and sequential logic blocks using the device’s 474,600 logic elements and embedded memory.
• Memory-intensive functions  Use the approximately 42 Mbits of on-chip RAM for buffering, packet storage, or local data processing.
• Multi-interface systems  Leverage 304 I/O pins to connect parallel buses, multiple peripherals, and diverse external devices without extensive external glue logic.

Unique Advantages

• High integration density: The large logic element count reduces the need for multiple discrete devices, simplifying system architecture.
• Substantial on-chip RAM: Approximately 42 Mbits of embedded memory enables local data handling and reduces external memory dependency.
• Ample I/O capacity: 304 I/Os support complex interfacing and multiple simultaneous external connections.
• Compact BGA package: The 900-FCBGA (31×31) package offers high pin count in a compact footprint for space-constrained PCBs.
• Extended temperature range: Rated from 0 °C to 110 °C to address designs requiring broader operating temperatures than standard commercial-only parts.
• RoHS compliant: Meets environmental and lead-free manufacturing requirements.

Why Choose XCKU5P-L2FFVD900E?

The XCKU5P-L2FFVD900E positions itself as a high-density, memory-capable FPGA option within the Kintex UltraScale+ family, combining nearly half a million logic elements with substantial on-chip RAM and a large I/O complement. Its 900-FCBGA package and surface-mount mounting make it suitable for compact, high-pin-count board layouts, while the extended temperature rating and RoHS compliance support robust manufacturing and deployment considerations.

This device is well suited for designs that require significant programmable logic and embedded memory in a single device footprint, offering scalability within systems that demand integration, a high I/O count, and adherence to lead-free environmental standards.

Request a quote or submit an inquiry to receive pricing and availability information for the XCKU5P-L2FFVD900E.