MPC8360ECZUAJDGA

IC MPU MPC83XX 533MHZ 740TBGA
Part Description

PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 533MHz 740-TBGA (37.5x37.5)

Quantity 295 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Core ProcessorPowerPC e300Device Package740-TBGA (37.5x37.5)Mounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C – 105°CPackage / CaseTray
Speed533MHzVoltage1.8V, 2.5V, 3.3V

Overview of MPC8360ECZUAJDGA – PowerPC e300 533 MHz 1‑Core 32‑Bit Microprocessor

The MPC8360ECZUAJDGA is a PowerQUICC II Pro communications processor featuring a single PowerPC e300 core running at 533 MHz. It is designed for embedded networking and telecommunications applications that require a compact, integrated processor with data- and control‑plane capability.

Targeted markets include networking, wireless infrastructure and telecommunications. The device emphasizes higher CPU performance, expanded functionality and faster interfaces to address time‑to‑market, price, power and package size constraints.

Key Features

  • Core and Performance Single PowerPC e300 core operating at 533 MHz with a 32‑bit bus width for standard embedded processing tasks.
  • Instruction and Data Cache e300 core includes on‑core caches (32 Kbytes instruction and 32 Kbytes data as described in the product reference), improving single‑threaded code execution and deterministic response.
  • QUICC Engine Integration On‑chip QUICC Engine module provides protocol termination, interworking and switching between communication protocols for integrated packet and protocol handling.
  • Peripheral and I/O Support Device documentation describes multiple peripheral controllers including three‑speed Ethernet (UCC Ethernet controller), PCI, USB, SPI, I2C, DUART, timers, GPIO, JTAG and serial interfaces (HDLC, BISYNC, UART), enabling broad system connectivity.
  • Memory and Storage Interfaces Support for DDR and DDR2 SDRAM is documented for system memory interfacing and flexible memory subsystem design.
  • Package and Mounting Supplied in a 740‑TBGA package (37.5 × 37.5 mm) and intended for surface‑mount assembly; package case is listed as tray.
  • Industrial Qualification The part is specified with industrial qualification, suitable for embedded applications requiring industrial‑grade components.
  • System Design Resources Comprehensive reference documentation and a product reference manual are available for system integration, clocking, reset initialization, thermal and pin‑out information as described in the device documentation.

Typical Applications

  • DSLAMs and Access Equipment — Used as a communications control processor for packet handling, protocol interworking and management functions in access network equipment.
  • 3G/Cellular Base Station Cards — Suited for network interface and control tasks in network interface cards for 3G base stations (Node Bs).
  • Routers and Media Gateways — Acts as a control‑plane processor with data‑plane capabilities for routing, switching and gateway functions.
  • Integrated Access Devices (IADs) — Deployed in high‑end IADs for service aggregation, protocol termination and management features.

Unique Advantages

  • Single‑Core Deterministic Performance: A dedicated PowerPC e300 core at 533 MHz with on‑core instruction and data caches provides consistent single‑thread performance for real‑time control tasks.
  • Integrated Communications Engine: The QUICC Engine module delivers built‑in protocol termination, interworking and switching capabilities, reducing external offload requirements.
  • Broad Peripheral Set: On‑chip support for Ethernet, PCI, USB, serial interfaces, timers and common buses enables flexible system architectures with fewer external controllers.
  • Memory Interface Flexibility: Documented support for DDR and DDR2 SDRAM simplifies memory subsystem design across a range of performance targets.
  • Industrial Grade: Industrial qualification supports deployment in commercial and industrial embedded systems.
  • Compact TBGA Packaging: 740‑TBGA (37.5 × 37.5 mm) package supports high pin counts in a compact footprint for dense board layouts.

Why Choose MPC8360ECZUAJDGA?

The MPC8360ECZUAJDGA positions itself as an integrated communications processor combining a PowerPC e300 core, on‑core caches and the QUICC Engine to address embedded networking and telecommunications designs that require both control‑plane and data‑plane functionality. Its documented peripheral set and memory interface options enable designers to implement protocol handling, Ethernet connectivity and standard host interfaces with a single device.

This part is appropriate for system designers building DSLAMs, base station interface cards, routers, media gateways and high‑end IADs who need a documented processor family with reference manuals and system design information to accelerate development and deployment.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for MPC8360ECZUAJDGA.

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