MPC8360EVVALFHA

POWERQUICC 32 BIT POWER ARCH SOC
Part Description

POWERQUICC 32 BIT POWER ARCH SOC

Quantity 278 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; QUICC EngineCore ProcessorPowerPC e300Device Package740-TBGA (37.5x37.5)
ECCN5A002A1Ethernet10/100/1000Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelN/AMounting MethodSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0 °C – 105 °CQualificationConsumer
RAM ControllersDDR, DDR2REACH ComplianceREACH UnknownRoHS ComplianceUnknown
USBUSB 1.x (1)Voltage – I/O1.8 V – 3.3 V

Overview of MPC8360EVVALFHA – POWERQUICC 32 BIT POWER ARCH SOC

The MPC8360EVVALFHA is a POWERQUICC II Pro communications processor from NXP Semiconductors built around a single PowerPC e300 core. It targets networking, wireless infrastructure, and telecommunications applications with integrated communications-oriented functionality.

Designed for control-plane and data-plane tasks, the device combines a PowerPC e300 core with an on-chip QUICC Engine and multiple interface controllers to address applications such as DSLAMs, 3G base station network interface cards, routers, media gateways, and high-end IADs.

Key Features

  • Core  Single PowerPC e300 core with 32 Kbytes of instruction cache and 32 Kbytes of data cache, compatible with the Power Architecture™ 603e instruction set as described in the product documentation.
  • Communications Co-Processor  Integrated QUICC Engine for communications termination, interworking, and switching between protocols, enabling dedicated packet and protocol handling.
  • Memory Controllers  On-chip controllers for DDR and DDR2 SDRAM to support system memory configurations commonly used in embedded communications designs.
  • Ethernet  One 10/100/1000 Mbps Ethernet interface for three-speed network connectivity and MII management functionality referenced in the device documentation.
  • USB and Serial I/O  USB 1.x interface (1) plus DUART support for serial communications and peripheral connectivity.
  • System Interfaces and Peripherals  Integrated subsystems and controllers referenced in the processor documentation include PCI, local bus, JTAG, I2C, SPI, timers, GPIO and other common embedded interfaces.
  • Package and Mounting  Supplied in a 740-pin TBGA package (37.5 × 37.5 mm), surface-mountable for compact board designs.
  • Operating Range and Compliance  Qualified for consumer applications, RoHS compliant, with an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • DSLAMs  Use as a communications processor for line aggregation, protocol handling, and control functions in digital subscriber line access multiplexers.
  • 3G Base Station NICs (Node B)  Integration into network interface cards for wireless infrastructure where protocol interworking and link connectivity are required.
  • Routers and Media Gateways  Control-plane and data-plane processing for packet forwarding, termination, and protocol conversion in carrier and enterprise network equipment.
  • High-end IADs  Embedded systems requiring integrated communications controllers and flexible memory interfaces for multi-service access devices.

Unique Advantages

  • Highly integrated communications processing: The combination of the PowerPC e300 core and the QUICC Engine consolidates control and communications functions on a single SoC to reduce system complexity.
  • Memory interface flexibility: DDR and DDR2 SDRAM controllers on-chip enable designers to choose memory architectures that match performance and cost targets.
  • Broad wired connectivity: Built-in three-speed Ethernet (10/100/1000 Mbps) plus USB 1.x and DUART support common network and peripheral interfaces directly from the processor.
  • Compact, production-ready package: 740-pin TBGA (37.5 × 37.5 mm) surface-mount package simplifies board-level integration for space-constrained designs.
  • Designed for communications markets: Documentation and feature set are targeted at networking, wireless infrastructure, and telecommunications applications such as DSLAMs and routers.
  • Regulatory and environmental readiness: RoHS compliance and consumer qualification status support environmentally regulated product development.

Why Choose MPC8360EVVALFHA?

The MPC8360EVVALFHA positions itself as a communications-focused SoC combining a PowerPC e300 core with a dedicated QUICC Engine and comprehensive peripheral support. Its integrated DDR/DDR2 memory controllers and three-speed Ethernet provide the connectivity and memory options commonly required by networking and telecom equipment designers.

This device is suited to teams building embedded communications products that need a consolidated processor offering control-plane and data-plane capability, compact packaging, and development documentation oriented to networking and infrastructure applications.

Request a quote or submit an inquiry to obtain pricing and availability for the MPC8360EVVALFHA and to discuss how it fits your embedded communications design needs.

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