MPC8360EVVALFHA
| Part Description |
POWERQUICC 32 BIT POWER ARCH SOC |
|---|---|
| Quantity | 278 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8360 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; QUICC Engine | Core Processor | PowerPC e300 | Device Package | 740-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 | Ethernet | 10/100/1000Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0 °C – 105 °C | Qualification | Consumer | ||
| RAM Controllers | DDR, DDR2 | REACH Compliance | REACH Unknown | RoHS Compliance | Unknown | ||
| USB | USB 1.x (1) | Voltage – I/O | 1.8 V – 3.3 V |
Overview of MPC8360EVVALFHA – POWERQUICC 32 BIT POWER ARCH SOC
The MPC8360EVVALFHA is a POWERQUICC II Pro communications processor from NXP Semiconductors built around a single PowerPC e300 core. It targets networking, wireless infrastructure, and telecommunications applications with integrated communications-oriented functionality.
Designed for control-plane and data-plane tasks, the device combines a PowerPC e300 core with an on-chip QUICC Engine and multiple interface controllers to address applications such as DSLAMs, 3G base station network interface cards, routers, media gateways, and high-end IADs.
Key Features
- Core Single PowerPC e300 core with 32 Kbytes of instruction cache and 32 Kbytes of data cache, compatible with the Power Architecture™ 603e instruction set as described in the product documentation.
- Communications Co-Processor Integrated QUICC Engine for communications termination, interworking, and switching between protocols, enabling dedicated packet and protocol handling.
- Memory Controllers On-chip controllers for DDR and DDR2 SDRAM to support system memory configurations commonly used in embedded communications designs.
- Ethernet One 10/100/1000 Mbps Ethernet interface for three-speed network connectivity and MII management functionality referenced in the device documentation.
- USB and Serial I/O USB 1.x interface (1) plus DUART support for serial communications and peripheral connectivity.
- System Interfaces and Peripherals Integrated subsystems and controllers referenced in the processor documentation include PCI, local bus, JTAG, I2C, SPI, timers, GPIO and other common embedded interfaces.
- Package and Mounting Supplied in a 740-pin TBGA package (37.5 × 37.5 mm), surface-mountable for compact board designs.
- Operating Range and Compliance Qualified for consumer applications, RoHS compliant, with an operating temperature range of 0 °C to 105 °C.
Typical Applications
- DSLAMs Use as a communications processor for line aggregation, protocol handling, and control functions in digital subscriber line access multiplexers.
- 3G Base Station NICs (Node B) Integration into network interface cards for wireless infrastructure where protocol interworking and link connectivity are required.
- Routers and Media Gateways Control-plane and data-plane processing for packet forwarding, termination, and protocol conversion in carrier and enterprise network equipment.
- High-end IADs Embedded systems requiring integrated communications controllers and flexible memory interfaces for multi-service access devices.
Unique Advantages
- Highly integrated communications processing: The combination of the PowerPC e300 core and the QUICC Engine consolidates control and communications functions on a single SoC to reduce system complexity.
- Memory interface flexibility: DDR and DDR2 SDRAM controllers on-chip enable designers to choose memory architectures that match performance and cost targets.
- Broad wired connectivity: Built-in three-speed Ethernet (10/100/1000 Mbps) plus USB 1.x and DUART support common network and peripheral interfaces directly from the processor.
- Compact, production-ready package: 740-pin TBGA (37.5 × 37.5 mm) surface-mount package simplifies board-level integration for space-constrained designs.
- Designed for communications markets: Documentation and feature set are targeted at networking, wireless infrastructure, and telecommunications applications such as DSLAMs and routers.
- Regulatory and environmental readiness: RoHS compliance and consumer qualification status support environmentally regulated product development.
Why Choose MPC8360EVVALFHA?
The MPC8360EVVALFHA positions itself as a communications-focused SoC combining a PowerPC e300 core with a dedicated QUICC Engine and comprehensive peripheral support. Its integrated DDR/DDR2 memory controllers and three-speed Ethernet provide the connectivity and memory options commonly required by networking and telecom equipment designers.
This device is suited to teams building embedded communications products that need a consolidated processor offering control-plane and data-plane capability, compact packaging, and development documentation oriented to networking and infrastructure applications.
Request a quote or submit an inquiry to obtain pricing and availability for the MPC8360EVVALFHA and to discuss how it fits your embedded communications design needs.

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