MPC8360VVAGDGA
| Part Description |
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 400MHz 740-TBGA (37.5x37.5) |
|---|---|
| Quantity | 365 Available (as of October 7, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8360 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC e300 | Device Package | 740-TBGA (37.5x37.5) | Mounting Type | Surface Mount | ||
|---|---|---|---|---|---|---|---|
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C – 105°C | Package / Case | Tray | ||
| Speed | 400MHz | Voltage | 1.8V, 2.5V, 3.3V |
Overview of MPC8360VVAGDGA – IC MPU MPC83XX 400MHZ 740TBGA
The MPC8360VVAGDGA is a PowerPC e300-based microprocessor featuring a single 32-bit core operating at 400 MHz in a 740‑TBGA (37.5 × 37.5 mm) package. It is positioned as a cost-effective, highly integrated communications processor for networking, wireless infrastructure, and telecommunications applications.
The device targets use in systems where higher CPU performance, additional functionality and faster interfaces are required while addressing time-to-market, price, power, and package size constraints.
Key Features
- Core & Performance Single PowerPC e300 core, 32-bit architecture running at 400 MHz with 32 Kbytes of instruction cache and 32 Kbytes of data cache; compatible with the Power Architecture™ 603e instruction set.
- QUICC Engine Integrated QUICC Engine module provides termination, interworking, and switching functionality for communications protocols.
- Memory & Bus Support Device documentation includes DDR and DDR2 SDRAM support and a Local Bus interface for external memory and peripheral connections.
- Network & I/O Interfaces On-chip controllers and interfaces referenced in the product documentation include a UCC Ethernet controller (three-speed Ethernet), PCI, USB, I2C, SPI, DUART, HDLC/UART variants, TDM/SI and MII management.
- System & Debug Support for JTAG and a variety of system peripherals such as timers, GPIO and an interrupt controller (IPIC) are detailed in the reference material.
- Package & Mounting Supplied in a 740‑TBGA tray package, 37.5 × 37.5 mm, designed for surface-mount assembly.
- Qualification Product qualification is listed as Consumer.
Typical Applications
- DSLAMs and Broadband Access — Used as an integrated communications processor for line-card and access aggregation functions.
- Wireless Infrastructure — Documented target for network interface cards in 3G base stations (Node Bs) and related equipment.
- Routers and Media Gateways — Suitable for control-plane and data-plane roles in routing and media gateway products.
- Network Interface Cards — Applied in NICs for telecommunications and high-end integrated access devices (IADs).
Unique Advantages
- High integration for communications Described as a highly integrated communications processor with multiple on-chip controllers and protocol support to address complex networking tasks.
- Balanced CPU capability A 400 MHz PowerPC e300 core with dedicated I/D caches provides deterministic processing capacity for embedded control and protocol handling.
- QUICC Engine for protocol interworking The integrated QUICC Engine supports termination, interworking and switching to streamline protocol handling within the processor.
- Comprehensive peripheral set Built-in Ethernet, PCI, USB, serial, timer, and bus interfaces reduce the need for external controllers as documented in the reference material.
- Compact TBGA packaging The 740‑TBGA (37.5 × 37.5 mm) package supports high pin density and surface-mount assembly for space-constrained designs.
- Designed for telecom and networking markets The device documentation explicitly targets networking, wireless infrastructure, and telecommunications applications, aligning feature sets to those markets.
Why Choose MPC8360VVAGDGA?
The MPC8360VVAGDGA combines a PowerPC e300 single-core architecture with multi-function on-chip connectivity and a QUICC Engine to address embedded communications requirements. Its documented emphasis on higher CPU performance, additional functionality and faster interfaces makes it suitable for designs in networking and telecommunications where integration and compact packaging are important.
This part is appropriate for engineers and procurement teams building solutions such as DSLAMs, base-station interface cards, routers and media gateways who need a documented, communications-focused processor with a comprehensive peripheral set and a compact 740‑TBGA package.
Request a quote or submit an inquiry today to check availability, pricing, and to obtain the full technical documentation for design integration.

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