 | | CYT2B75CADQ0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 57x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,657 | |
 | | CYT2B75CADQ0AZSGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 57x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 74 | |
 | | CYT2B75CADQ0AZSGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 57x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 748 | |
 | N/A | CYT2B75CADR0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 57x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 839 | |
 | | CYT2B75CADR0AZSGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 57x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,005 | |
 | | CYT2B77BADQ0AZEGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 134 | |
 | | CYT2B77BADQ0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 109 | |
 | | CYT2B77BADQ0AZSGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 468 | |
 | | CYT2B77BADQ0AZSGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 404 | |
 | | CYT2B77CADQ0AZEGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 693 | |
 | | CYT2B77CADQ0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,236 | |
 | | CYT2B77CADQ0AZSGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 15 | |
 | | CYT2B77CADQ0AZSGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 644 | |
 | N/A | CYT2B77CADR0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,899 | |
 | | CYT2B78BADQ0AZEGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 176QFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 369 | |
 | | CYT2B78BADQ0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 176QFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 497 | |
 | | CYT2B78BADQ0AZSGS | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 176QFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 896 | |
 | | CYT2B78BADQ0AZSGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 176QFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 73 | |
 | | CYT2B78CADQ0AZEGS | Infineon Technologies | TVII-B-E-1M-176 CFLASH 1MB | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+/M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 536 | |
 | | CYT2B78CADQ0AZEGST | Infineon Technologies | IC MCU 32BT 1.0625MB FLSH 176QFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 82x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,108 | |