| N/A | | CYT4BF8CEDR0AESGST | Infineon Technologies | TRAVEO-2 BODY HIGH-END | Microcontrollers | N/A | N/A | N/A | N/A | 157 | |
 | | CYT4BFBCHDQ0BZEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 138 | |
 | | CYT4BFBCHDQ0BZEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 777 | |
 | | CYT4BFBCHDQ0BZSGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 103 | |
 | | CYT4BFBCHDQ0BZSGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 161 | |
 | | CYT4BFBCJDQ0BZEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,302 | |
 | | CYT4BFBCJDQ0BZEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,108 | |
 | | CYT4BFBCJDQ0BZSGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,673 | |
 | | CYT4BFBCJDQ0BZSGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 10 | |
 | | CYT4BFCCHDQ0BZEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 1,017 | |
 | | CYT4BFCCHDQ0BZEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 1,336 | |
 | | CYT4BFCCHDQ0BZSGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 1,138 | |
 | | CYT4BFCCHDQ0BZSGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 852 | |
 | | CYT4BFCCHDR0BZEGST | Infineon Technologies | IC MCU 32BIT 8.188MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, Temp Sensor, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 958 | |
 | | CYT4BFCCJDQ0BZEGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+/M4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 485 | |
 | | CYT4BFCCJDQ0BZEGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 594 | |
 | | CYT4BFCCJDQ0BZSGS | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 1,393 | |
 | | CYT4BFCCJDQ0BZSGST | Infineon Technologies | IC MCU 32BT 8.1875MB FLSH 320BGA | Microcontrollers | 320-BGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F Core Size: 32-Bit Quad-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Program Memory Size: 8.1875MB (8.1875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 114x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 320-BGA (17×17) | 625 | |
 | | CYT4DNJBRCQ1BZSGS | Infineon Technologies | IC MCU 32BIT 6.188MB FLSH 327BGA | Microcontrollers | 327-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Quad-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 6.188MB (6.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 327-BGA | 105 | |
 | N/A | CYT4DNJBRCQ1BZSGST | Infineon Technologies | IC MCU 32BIT 6.188MB FLSH 327BGA | Microcontrollers | 327-BGA | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F Core Size: 32-Bit Quad-Core Connectivity: DMA, I2S, LVD, Temp Sensor, WDT Peripherals: DMA, I2S, LVD, Temp Sensor, WDT Program Memory Size: 6.188MB (6.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 327-BGA | 757 | |