| N/A | N/A | S6J323CKSMSE20000 | Infineon Technologies | IC MCU 32B 2.112MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 609 | |
 | | S6J323CKSPSE20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,133 | |
| N/A | | S6J323CLSMSC2000A | Infineon Technologies | IC MCU 32B 2.112MB FLSH 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 487 | |
 | | S6J323CLSPSC20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 1,950 | |
 | | S6J323CLUPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 732 | |
| N/A | N/A | S6J324CKSFSE2000A | Infineon Technologies | IC MCU 32BIT 2.17MB FLSH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.17MB (2.17M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 46x12b; D/A 1x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 687 | |
| N/A | | S6J324CKSMSE2000A | Infineon Technologies | IC MCU 32B 2.112MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 48 | |
 | | S6J324CKSPSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 709 | |
 | | S6J324CLSPSC20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 35 | |
 | | S6J325CKSFSE2000A | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 432 | |
 | | S6J325CKSPSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,242 | |
 | | S6J325CLSPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 506 | |
 | | S6J325CLUPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 1,473 | |
 | | S6J326CKSPSE20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,290 | |
| N/A | N/A | S6J326CLSASE1000A | Infineon Technologies | IC MCU 32BIT 1.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 1.0625MB (1.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b; D/A 1x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 949 | |
 | | S6J326CLSPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 946 | |
 | | S6J327CKSPSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,109 | |
 | | S6J327CLSPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 979 | |
 | | S6J327CLUPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 518 | |
| N/A | | S6J328CKSMSE2000A | Infineon Technologies | IC MCU 32B 2.112MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 351 | |