 | | S6J328CKSPSE20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 589 | |
| N/A | | S6J328CLSMSC20000 | Infineon Technologies | IC MCU 32B 2.112MB FLSH 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 939 | |
| N/A | | S6J328CLSMSC2000A | Infineon Technologies | IC MCU 32B 2.112MB FLSH 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 1 | |
 | | S6J328CLSPSC20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 476 | |
 | | S6J328CLSPSC2D000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 498 | |
 | | S6J329CKSPSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 721 | |
 | | S6J329CKUPSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 269 | |
| N/A | | S6J329CLSMSC2000A | Infineon Technologies | IC MCU 32B 2.112MB FLSH 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 564 | |
 | | S6J329CLSPSC20000 | Infineon Technologies | IC MCU 32BIT 2.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 556 | |
 | | S6J329CLSPSC2D000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 477 | |
 | | S6J329CLUPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 398 | |
| N/A | N/A | S6J32AALSASE2000A | Infineon Technologies | IC MCU 32BIT 2.0625MB 216TEQFP | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.0625MB (2.0625M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) | 1,212 | |
| N/A | | S6J32BAKSESE2000A | Infineon Technologies | IC MCU 32B 2.112MB FLASH 208TQFP | Microcontrollers | 208-TQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2.112MB (2.112M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.15V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 931 | |
 | | S6J32EEKSNSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,296 | |
 | | S6J32EELSNSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 258 | |
 | | S6J32EELTMSC2000A | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 936 | |
 | | S6J32EELTPSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 695 | |
 | | S6J32FEKSNSE20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 46x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,598 | |
 | | S6J32FELSNSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 1,861 | |
 | | S6J32FELTNSC20000 | Infineon Technologies | TRAVEO-55NM | Microcontrollers | 216-TEQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 4.171875MB (4.171875M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 216-TEQFP (24×24) Package / Case: 216-LQFP Exposed Pad | 679 | |