 | | TC1796256F150EBCKDUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | Microcontrollers | PG-BGA-416 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416 | 411 | |
 | | TC1796256F150EBEKDUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | Microcontrollers | PG-BGA-416 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416 | 992 | |
 | | TC1796256F150EBEKDUMA2 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | Microcontrollers | PG-BGA-416 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416 | 53 | |
 | | TC1796256F150EBEKXUMA2 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 416BGA | Microcontrollers | PG-BGA-416 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416 | 134 | |
| N/A | | TC1797384F150EACKDUMA1 | Infineon Technologies | IC MCU 32BIT 3MB FLASH 416BGA | Microcontrollers | PG-BGA-416-10 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, FlexRay, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 4x10b, 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416-10 | 189 | |
| N/A | | TC1797384F150EACKXUMA1 | Infineon Technologies | IC MCU 32BIT 3MB FLASH 416BGA | Microcontrollers | PG-BGA-416-10 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, FlexRay, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 4x10b, 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416-10 | 768 | |
| N/A | | TC1797512F180EFACKXUMA1 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | Microcontrollers | PG-BGA-416-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, FlexRay, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.42V ~ 1.58V Data Converters: A/D 4x10b, 44x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-BGA-416-27 | 24 | |
 | | TC1798F512F300EPABKXUMA2 | Infineon Technologies | IC MCU 32BIT 4MB FLASH 516LFBGA | Microcontrollers | PG-LFBGA-516-5 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: ASC, CANbus, EBI/EMI, FlexRay, MLI, MSC, SSC Peripherals: DMA, POR, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.235V ~ 3.63V Data Converters: A/D 8x10b, 64x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-516-5 | 784 | |
 | | TC212L8F133FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 14x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 1,053 | |
 | | TC212L8F133FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 253 | |
 | | TC212L8F133NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 571 | |
 | | TC212L8F133NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 202 | |
 | N/A | TC212S8F133FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 14x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 1,534 | |
 | | TC212S8F133FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 1,244 | |
 | | TC212S8F133NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 800 | |
 | | TC212S8F133SCACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 80TQFP | Microcontrollers | PG-TQFP-80-7 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-80-7 Package / Case: 80-TQFP Exposed Pad | 1,283 | |
 | | TC213L8F133FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 295 | |
 | | TC213L8F133FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 808 | |
 | | TC213L8F133NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 335 | |
 | | TC213L8F133NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, LINbus, QSPI Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 1,079 | |