 | | TC224L16F133FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,072 | |
 | | TC224L16F133FACLXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 508 | |
 | | TC224L16F133NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 425 | |
 | | TC224L16F133NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 503 | |
 | | TC224S16F133FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 607 | |
 | | TC233L32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 255 | |
 | | TC233L32F200FABKXUMA2 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Peripherals: DMA, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 66 | |
 | | TC233L32F200FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-3 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-3 | 975 | |
 | | TC233L32F200FACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 832 | |
 | | TC233L32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 1,284 | |
 | | TC233LP32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-3 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-3 | 535 | |
 | | TC233LP32F200FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 1,051 | |
 | | TC233LP32F200FACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 114 | |
 | | TC233LP32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 1,146 | |
 | | TC233LP32F200NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100TQFP | Microcontrollers | PG-TQFP-100-23 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-100-23 Package / Case: 100-TQFP Exposed Pad | 579 | |
 | | TC234L32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,573 | |
 | | TC234L32F200FACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 583 | |
 | | TC234L32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 1,059 | |
 | | TC234LA32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-27 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-27 Package / Case: 144-LQFP Exposed Pad | 464 | |
 | | TC234LP32F200FABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144TQFP | Microcontrollers | PG-TQFP-144-2 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-TQFP-144-2 | 1,107 | |