 | | XMC4800F100F1536AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1.5MB FLASH 100LQFP | Microcontrollers | PG-LQFP-100-25 | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-25 Package / Case: 100-LQFP Exposed Pad | 877 | |
 | | XMC4800F100F2048AAXQMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100LQFP | Microcontrollers | PG-LQFP-100-25 | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-25 Package / Case: 100-LQFP Exposed Pad | 326 | |
 | | XMC4800F100K1024AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 100LQFP | Microcontrollers | PG-LQFP-100-25 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-25 Package / Case: 100-LQFP Exposed Pad | 1,162 | |
 | | XMC4800F100K1536AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1.5MB FLASH 100LQFP | Microcontrollers | PG-LQFP-100-25 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-25 Package / Case: 100-LQFP Exposed Pad | 457 | |
 | | XMC4800F100K2048AAXQMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 100LQFP | Microcontrollers | PG-LQFP-100-25 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-100-25 Package / Case: 100-LQFP Exposed Pad | 306 | |
 | | XMC4800F144F1024AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 1,433 | |
 | | XMC4800F144F1536AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 470 | |
 | | XMC4800F144F2048AAXQMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 438 | |
 | | XMC4800F144K1024AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 407 | |
 | | XMC4800F144K1536AAXQMA1 | Infineon Technologies | IC MCU 32BIT 1.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 840 | |
 | | XMC4800F144K2048AAXQMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-24 | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.13V ~ 3.63V Data Converters: A/D 32x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-24 Package / Case: 144-LQFP Exposed Pad | 4 | |
 | | XMC6221SCQ024XABXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 73 | |
 | | XMC7100-E272K4160AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 676 | |
 | | XMC7100-F100K1088AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 1.088M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 798 | |
 | | XMC7100-F100K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 766 | |
 | | XMC7100-F100K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,386 | |
 | | XMC7100-F144K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 1,175 | |
 | | XMC7100-F144K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 144QFP | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 735 | |
 | | XMC7100-F176K4160AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 324 | |
 | | XMC7100D-E272K4160AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 72x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 665 | |