 | | XMC7100D-F100K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 247 | |
 | | XMC7100D-F100K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 100QFP | Microcontrollers | 100-TEQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 37x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TEQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 879 | |
| N/A | | XMC7100D-F144K2112AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 2.112M x 8 Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 629 | |
 | | XMC7100D-F144K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 144QFP | Microcontrollers | 144-TEQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 52x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-TEQFP (20×20) Package / Case: 144-LQFP Exposed Pad | 670 | |
 | | XMC7100D-F176K4160AA | Infineon Technologies | IC MCU 32BT 4.063MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 4.063MB (4.063M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 64x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 1,482 | |
 | | XMC7200-E272K8384AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 96x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,120 | |
 | | XMC7200-F176K8384AA | Infineon Technologies | INDUSTRIAL MCUS | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 81x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 128 | |
 | | XMC7200D-E272K8384AA | Infineon Technologies | IC MCU 32BIT 8.188MB FLSH 272BGA | Microcontrollers | 272-BGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 96x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 272-BGA (16×16) | 1,178 | |
 | | XMC7200D-F176K8384AA | Infineon Technologies | IC MCU 32BT 8.188MB FLSH 176QFP | Microcontrollers | 176-TEQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FIFO, I2C, IrDA, MMC/SD/SDIO, SPI, UART/USART Peripherals: Brown-out Detect/Reset, Crypto – AES, DMA, LVD, POR, PWM, SHA, Temp Sensor, TRNG, WDT Program Memory Size: 8.188MB (8.188M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 81x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-TEQFP (24×24) Package / Case: 176-LQFP Exposed Pad | 914 | |
 | | XMC7201SCQ024XABXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 1,543 | |
 | | XMC7241SCQ040XAAXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 1,201 | |
 | | XMC8231SCQ024XABXUMA1 | Infineon Technologies | XMC1000 | Microcontrollers | N/A | N/A | N/A | N/A | 128 | |