 | | PIC32MZ1025DAL176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,373 | |
 | | PIC32MZ1025DAL176T-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 5 | |
 | | PIC32MZ1025DAR169-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 873 | |
 | | PIC32MZ1025DAR169-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 312 | |
 | | PIC32MZ1025DAR169T-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,051 | |
 | | PIC32MZ1025DAR169T-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 319 | |
 | | PIC32MZ1025DAR176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 877 | |
 | | PIC32MZ1025DAR176-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,431 | |
 | | PIC32MZ1025DAR176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 815 | |
 | | PIC32MZ1025DAR176T-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,468 | |
 | | PIC32MZ1025DAS169-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 693 | |
 | | PIC32MZ1025DAS169-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,204 | |
 | | PIC32MZ1025DAS169T-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,190 | |
 | | PIC32MZ1025DAS169T-V/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 663 | |
 | | PIC32MZ1025DAS176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 619 | |
 | | PIC32MZ1025DAS176-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 398 | |
 | | PIC32MZ1025DAS176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 114 | |
 | | PIC32MZ1025DAS176T-V/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,462 | |
 | N/A | PIC32MZ1025W104132-I/NX | Microchip Technology | IC MCU 32BIT 1MB FLASH 132VQFN | Microcontrollers | 132-VQFN (10x10) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® M-Class Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, IrDA, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.97V ~ 3.63V Data Converters: A/D 20x12b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-VQFN (10×10) Package / Case: 132-VFQFN Dual Rows, Exposed Pad | 1,112 | |
 | | PIC32MZ1064DAA169-I/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 311 | |