 | | PIC32MZ1064DAA169T-I/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 150 | |
 | | PIC32MZ1064DAA176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 452 | |
 | | PIC32MZ1064DAA176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 68 | |
 | | PIC32MZ1064DAA288-I/4J | Microchip Technology | IC MCU 32BIT 1MB FLASH 288LFBGA | Microcontrollers | 288-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 288-LFBGA (15×15) | 1,736 | |
 | | PIC32MZ1064DAA288T-I/4J | Microchip Technology | IC MCU 32BIT 1MB FLASH 288LFBGA | Microcontrollers | 288-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 288-LFBGA (15×15) | 152 | |
 | | PIC32MZ1064DAB169-I/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,201 | |
 | | PIC32MZ1064DAB169T-I/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,019 | |
 | | PIC32MZ1064DAB176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 728 | |
 | | PIC32MZ1064DAB176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 26 | |
 | | PIC32MZ1064DAB288-I/4J | Microchip Technology | IC MCU 32BIT 1MB FLASH 288LFBGA | Microcontrollers | 288-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 288-LFBGA (15×15) | 418 | |
 | | PIC32MZ1064DAB288T-I/4J | Microchip Technology | IC MCU 32BIT 1MB FLASH 288LFBGA | Microcontrollers | 288-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 288-LFBGA (15×15) | 635 | |
 | | PIC32MZ1064DAG169-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 168 | |
 | | PIC32MZ1064DAG169T-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 201 | |
 | | PIC32MZ1064DAG176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,434 | |
 | | PIC32MZ1064DAG176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,554 | |
 | | PIC32MZ1064DAH169-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 860 | |
 | | PIC32MZ1064DAH169T-I/6J | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 163 | |
 | | PIC32MZ1064DAH176-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 16 | |
 | | PIC32MZ1064DAH176T-I/2J | Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,414 | |
 | | PIC32MZ1064DAK169-I/HF | Microchip Technology | IC MCU 32BIT 1MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 469 | |