 | | PIC32MZ2025DAB176T-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,371 | |
 | | PIC32MZ2025DAB288-I/4J | Microchip Technology | IC MCU 32BIT 2MB FLASH 288LFBGA | Microcontrollers | 288-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 288-LFBGA (15×15) | 217 | |
 | | PIC32MZ2025DAB288T-I/4J | Microchip Technology | IC MCU 32BIT 2MB FLASH 288LFBGA | Microcontrollers | 288-LFBGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 288-LFBGA (15×15) | 964 | |
 | | PIC32MZ2025DAG169-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 280 | |
 | | PIC32MZ2025DAG169T-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 168 | |
 | | PIC32MZ2025DAG176-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 999 | |
 | | PIC32MZ2025DAG176T-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 80 | |
 | | PIC32MZ2025DAH169-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,083 | |
 | | PIC32MZ2025DAH169T-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,121 | |
 | | PIC32MZ2025DAH176-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 316 | |
 | | PIC32MZ2025DAH176T-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 3.6V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,349 | |
 | | PIC32MZ2025DAK169-I/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,262 | |
 | | PIC32MZ2025DAK169-V/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 674 | |
 | | PIC32MZ2025DAK169T-I/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 962 | |
 | | PIC32MZ2025DAK169T-V/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,164 | |
 | | PIC32MZ2025DAK176-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 255 | |
 | | PIC32MZ2025DAK176-V/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,053 | |
 | | PIC32MZ2025DAK176T-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,216 | |
 | | PIC32MZ2025DAK176T-V/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 896 | |
 | | PIC32MZ2025DAL169-I/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 34 | |