 | | PIC32MZ2025DAL169-V/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 804 | |
 | | PIC32MZ2025DAL169T-I/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 330 | |
 | | PIC32MZ2025DAL169T-V/HF | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 754 | |
 | | PIC32MZ2025DAL176-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 862 | |
 | | PIC32MZ2025DAL176-V/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 12 | |
 | | PIC32MZ2025DAL176T-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,105 | |
 | | PIC32MZ2025DAL176T-V/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 964 | |
 | | PIC32MZ2025DAR169-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 875 | |
 | | PIC32MZ2025DAR169-V/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,079 | |
 | | PIC32MZ2025DAR169T-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,395 | |
 | | PIC32MZ2025DAR169T-V/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 872 | |
 | | PIC32MZ2025DAR176-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,572 | |
 | | PIC32MZ2025DAR176-V/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,639 | |
 | | PIC32MZ2025DAR176T-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 1,293 | |
 | | PIC32MZ2025DAR176T-V/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 196 | |
 | | PIC32MZ2025DAS169-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 1,015 | |
 | | PIC32MZ2025DAS169-V/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 621 | |
 | | PIC32MZ2025DAS169T-I/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 457 | |
 | | PIC32MZ2025DAS169T-V/6J | Microchip Technology | IC MCU 32BIT 2MB FLASH 169LFBGA | Microcontrollers | 169-LFBGA (11x11) | N/A | -40°C ~ 105°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-LFBGA (11×11) | 522 | |
 | | PIC32MZ2025DAS176-I/2J | Microchip Technology | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: MIPS32® microAptiv™ Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, PMP, SPI, SQI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, HLVD, I2S, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH RAM Size: 256K x 8 + 32MB DDR2 SDRAM Voltage – Supply (Vcc/Vdd): 1.7V ~ 1.9V Data Converters: A/D 45x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (20×20) Package / Case: 176-LQFP Exposed Pad | 858 | |