 | | FS32R274VBK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 1,435 | |
 | | FS32R274VBK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 34 | |
 | | FS32R274VCK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 90 | |
 | | FS32R274VCK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 464 | |
| N/A | | FS32R294HAK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 113 | |
| N/A | | FS32R294HAK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,226 | |
| N/A | | FS32R294HBK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,340 | |
| N/A | | FS32R294HBK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,443 | |
| N/A | | FS32R294HEK0MJDR | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 297 | |
| N/A | | FS32R294HEK0MJDT | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 723 | |
| N/A | | FS32R294HFK0MJDR | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 763 | |
| N/A | | FS32R294HFK0MJDT | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 121 | |
| N/A | | FS32R294JAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,593 | |
| N/A | | FS32R294JAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 770 | |
| N/A | | FS32R294JCK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | N/A | N/A | N/A | N/A | 267 | |
| N/A | | FS32R294JCK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Program Memory Type: ROMless Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,315 | |
| N/A | | FS32R294KAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,236 | |
| N/A | | FS32R294KAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 74 | |
| N/A | | FS32R294KCK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 893 | |
| N/A | | FS32R294KCK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 980 | |