| N/A | | K32L2B11VFT0AR | NXP Semiconductors | K32 L2B, 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 14x16b; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-UFQFN Exposed Pad | 361 | |
 | | K32L2B11VLH0A | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 338 | |
 | | K32L2B11VMP0A | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64MAPBGA | Microcontrollers | 64-MAPBGA (5x5) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 64-MAPBGA (5×5) | 1,560 | |
| N/A | | K32L2B11VMP0AR | NXP Semiconductors | K32 L2B, 64MAPBGA | Microcontrollers | 64-MAPBGA (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-MAPBGA (5×5) | 838 | |
| N/A | | K32L2B21VFM0A | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32QFN | Microcontrollers | 32-QFN (5x5) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 32-QFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 109 | |
 | | K32L2B21VFT0A | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-UFQFN Exposed Pad | 707 | |
| N/A | | K32L2B21VFT0AR | NXP Semiconductors | K32 L2B, 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 14x16b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-UFQFN Exposed Pad | 791 | |
 | | K32L2B21VLH0A | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 844 | |
| N/A | | K32L2B21VLH0AR | NXP Semiconductors | K32 L2B, 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,289 | |
 | | K32L2B21VMP0A | NXP Semiconductors | IC MCU 32BIT 128KB FLSH 64MAPBGA | Microcontrollers | 64-MAPBGA (5x5) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 64-MAPBGA (5×5) | 289 | |
| N/A | | K32L2B31VFM0A | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 32QFN | Microcontrollers | 32-QFN (5x5) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 32-QFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 314 | |
 | | K32L2B31VFT0A | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-UFQFN Exposed Pad | 542 | |
 | | K32L2B31VLH0A | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,095 | |
 | | K32L2B31VMP0A | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 64MAPBGA | Microcontrollers | 64-MAPBGA (5x5) | N/A | – | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.2V Mounting Type: Surface Mount Supplier Device Package: 64-MAPBGA (5×5) | 705 | |
 | | K32L3A60VPJ1AT | NXP Semiconductors | IC MCU 32B 1.25MB FLASH 176VFBGA | Microcontrollers | 176-VFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0+ Core Size: 32-Bit Dual-Core Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA (9×9) | 1,791 | |
| N/A | N/A | K32W022S1M2VPJAT | NXP Semiconductors | MCU BT5/FSK/THREAD 176-VFBGA | Microcontrollers | 176-VFBGA | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA | 1,522 | |
| N/A | N/A | K32W032S1M2CAVAR | NXP Semiconductors | MCU KINETIS BT5/FSK WLCSP | Microcontrollers | 191-WLCSP (5.97x5.85) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 191-WLCSP (5.97×5.85) | 48 | |
| N/A | N/A | K32W032S1M2VPJAT | NXP Semiconductors | MCU KINETIS BT5/FSK 176-VFBGA | Microcontrollers | 176-VFBGA | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA | 1,559 | |
 | | K32W041AK | NXP Semiconductors | IC MCU K32W041 +15DBM 40HVQFN | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 949 | |
 | | K32W041AMK | NXP Semiconductors | IC MCU K32W041 MCM 40HVQFN | RF Transceiver ICs | 40-HVQFN (6x6) | 1.9V ~ 3.6V | -40°C ~ 125°C | RF Family/Standard: 802.15.4, Bluetooth Protocol: Bluetooth v5.0, Thread, Zigbee® Memory Size: 640kB Flash, 152kB SRAM Serial Interfaces: I2C, SPI, PWM, UART Voltage – Supply: 1.9V ~ 3.6V Current – Receiving: 4.3mA Current – Transmitting: 7.4mA ~ 20.3mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6×6) | 1,789 | |