 | | TC237L32F200SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 742 | |
 | | TC237L32F200SABLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Peripherals: DMA, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 138 | |
 | | TC237L32F200SACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 641 | |
 | | TC237L32F200SACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 246 | |
 | | TC237LP32F200NACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 1.43V, 2.97V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 503 | |
 | | TC237LP32F200NACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TJ) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 1.43V, 2.97V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 1,258 | |
 | | TC237LP32F200SABKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 305 | |
 | | TC237LP32F200SACKXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 1,672 | |
 | | TC237LP32F200SACLXUMA1 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 292LFBGA | Microcontrollers | PG-LFBGA-292-6 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexRay, LINbus, QSPI Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LFBGA-292-6 | 623 | |
 | | TC264D40F200NBCKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 1,126 | |
 | | TC264D40F200NBCKXUMA2 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 48x12b SAR, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 218 | |
 | | TC264D40F200NBCLXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 150°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 48x12b SAR, 3 x Sigma-Delta Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 1,637 | |
 | | TC264D40F200WBBKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 247 | |
 | | TC264D40F200WBCKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 473 | |
 | | TC264DA40F200NBCKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 4 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 223 | |
| N/A | | TC264DA40F200NBCKXUMA2 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 43x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 361 | |
 | | TC264DA40F200WBBKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 4 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 1,316 | |
 | N/A | TC264DA40F200WBBKXUMA2 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Peripherals: DMA, POR, WDT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.17V ~ 5.5V Data Converters: A/D 40x12b SAR, Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 1,225 | |
 | | TC264DA40F200WBCKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 144LQFP | Microcontrollers | PG-LQFP-144-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 40x12b, 4 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-144-22 Package / Case: 144-LQFP Exposed Pad | 867 | |
 | | TC265D40F200NBCKXUMA1 | Infineon Technologies | IC MCU 32BIT 2.5MB FLASH 176LQFP | Microcontrollers | PG-LQFP-176-22 | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Program Memory Size: 2.5MB (2.5M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 3.3V, 5V Data Converters: A/D 50x12b, 3 x Sigma-Delta Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: PG-LQFP-176-22 Package / Case: 176-LQFP Exposed Pad | 297 | |