 | | TMX5700432PZQQ1 | Texas Instruments | IC MCU 16/32B 384KB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.32V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 122 | |
 | | TMX5700714APZQQ1 | Texas Instruments | IC MCU 32BIT 768KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,344 | |
 | | TMX5700714PGEQQ1 | Texas Instruments | IC MCU 32BIT 768KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 100 | |
 | | TMX5700714ZWTQQ1 | Texas Instruments | IC MCU 32BIT 768KB FLSH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 135 | |
 | | TMX5700914APGEQQ1 | Texas Instruments | IC MCU 16/32B 1MB FLASH 56HTSSOP | Microcontrollers | 56-HTSSOP | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 56-HTSSOP Package / Case: 56-PowerTSSOP (0.240″”, 6.10mm Width) | 1,448 | |
 | N/A | TMX5700914APZQQ1 | Texas Instruments | IC MCU 16/32BIT 1MB FLSH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, I2C, McBSP, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,067 | |
 | | TMX5700914PGEQQ1 | Texas Instruments | IC MCU 16/32BIT 1MB FLASH 144QFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b, 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,204 | |
 | | TMX5701227APGEQQ1 | Texas Instruments | IC MCU 16/32BIT 1.25MB 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SPI, UCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 965 | |
 | | TMX5701227AZWTQQ1 | Texas Instruments | IC MCU 32BIT 1.25MB FLASH 337BGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SPI, UCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 735 | |
 | | TMX5701227BZWTQQ1 | Texas Instruments | IC MCU 32BIT 1.25MB FLASH 337BGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SPI, UCI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 693 | |
 | | TMX5702125BPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 853 | |
 | | TMX5703134BPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 2MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,507 | |
 | | TMX5703137APGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 418 | |
 | | TMX5703137AZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,531 | |
 | | TMX5703137BPGEQQ1 | Texas Instruments | IC MCU 16/32BIT 3MB FLSH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,583 | |
 | | TMX5703137BZWTQQ1 | Texas Instruments | IC MCU 16/32B 3MB FLASH 337NFBGA | Microcontrollers | 337-NFBGA (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R4F Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.14V ~ 3.6V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 337-NFBGA (16×16) | 1,285 | |
 | | TN80C151SB16 | Intel | 8-BIT, 80151 CPU, 16MHZ | Microcontrollers | 44-PLCC | N/A | -40°C ~ 85°C (TA) | Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 44-PLCC Package / Case: 44-LCC (J-Lead) | 362 | |
 | N/A | TN80C152JB | Intel | 16-BIT EMBEDDED PROCESSSOR | Microcontrollers | N/A | N/A | N/A | N/A | 289 | |
 | | TN80C188EA20 | Intel | IC MPU I186 20MHZ 68PLCC | Microprocessors | 68-PLCC | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC | 632 | |
 | | TN80L188EA13 | Intel | IC MPU I186 13MHZ 68PLCC | Microprocessors | 68-PLCC | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 16-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC | 797 | |