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Total Products: 220,336
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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UPD70F3525GJA-GAE-X2-Q-GN/AUPD70F3525GJA-GAE-X2-Q-GRenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
115
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UPD70F3525GJA9-608-GAE-Q-HN/AUPD70F3525GJA9-608-GAE-Q-HRenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
697
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UPD70F3525GJA9-GAE-G
UPD70F3525GJA9-GAE-GRenesasIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
631
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UPD70F3525GJA9-GAE-H
UPD70F3525GJA9-GAE-HRenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
497
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UPD70F3525GJA9-GAE-X2-G
UPD70F3525GJA9-GAE-X2-GRenesasIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,293
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N/AN/AUPD70F3525GJA9-GBG-GRenesasIC MCU 32BIT 2MB FLASH 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
139
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N/AN/AUPD70F3526GJA-GBG-E1-Q-GRenesasIC MICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

1,281
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N/AN/AUPD70F3526GJA9-GAE-E2-D-GRenesasIC MICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

1,085
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UPD70F3526GJA9-GAE-Q-H
UPD70F3526GJA9-GAE-Q-HRenesasIC MCU 32BIT 3MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
820
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UPD70F3526GJA9-GAE-X3-G
UPD70F3526GJA9-GAE-X3-GRenesasIC MCU 32BIT 3MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
105
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
831
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N/AN/AUPD70F3526GJA9-GBG-E2-Q-GRenesasIC MICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

848
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N/AN/AUPD70F3529GMA-GBK-GRenesasMCU1 V850E2/D V850E2/DX4-HMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b, 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
667
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UPD70F3529GMA9-GBK-GN/AUPD70F3529GMA9-GBK-GRenesasIC MCU 32BIT 2GB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
127
Program Memory Size:
2GB (2G x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b, 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
896
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UPD70F3529GMA9-GBK-Q-GN/AUPD70F3529GMA9-GBK-Q-GRenesasIC MCU 32BIT 2GB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)2.7V - 5.5V-40°C – 105°C
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Program Memory Size:
2GB (2G x 8)
Mounting Type:
Surface Mount
1,462
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N/AN/AUPD70F3532F1A9-KN7-ARenesasMCU 32BIT HIGH-END FLASH V850E2/Microcontrollers352-BGA (23x23)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b, 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
352-BGA (23×23)
Package / Case:
352-BGA
1,496
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N/AN/AUPD70F3537F1A9-MNM-ARenesasIC MCU 32BIT 3MB FLASH 408BGAMicrocontrollers408-BGA (27x27)N/A-40°C ~ 105°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32×10/12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
408-BGA (27×27)
Package / Case:
408-BGA
1,706
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N/A
UPD70F3548AM1GCA1-UEU-AXRenesasIC MICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

648
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UPD70F3548M1GCA1-UEU-E2-DE-AXN/AUPD70F3548M1GCA1-UEU-E2-DE-AXRenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2/FG4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,283
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UPD70F3548M1GCA1-UEU-E3-QS-AXN/AUPD70F3548M1GCA1-UEU-E3-QS-AXRenesasIC MCU 32BIT 512KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2/FG4
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 20x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
452
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N/AN/AUPD70F3551M1GJA-GBG-QS-AXRenesasIC MCU 32B 512KB FLASH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
112
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
903
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