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Total Products: 220,336
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/AN/AUPD70F3551M1GJA1-GBG-QS-AXRenesasIC MCU 32BT 512KB FLSH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2M
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
112
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
278
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N/AN/AUPD70F3554M1GJA-GBG-QS-AXRenesasIC MCU 32B 1.5MB FLASH 144HLFQFPMicrocontrollers144-HLFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
112
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-HLFQFP (20×20)
Package / Case:
144-LQFP Exposed Pad
1,676
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N/AN/AUPD70F3557AM1GMA-GBK-E2-QS-AXRenesasIC MCU 32BIT 1.5MB FLSH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
1.5MB (1.5M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
112K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
148
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N/A
UPD70F3558AM1GMA1-GBK-AXRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
663
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N/AN/AUPD70F3558M1GM-GBK-AX#YGRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
246
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N/A
UPD70F3558M1GMA-GBK-AXRenesas32BIT MCU V850E2/FX4 T176_2424Microcontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
137
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
106
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N/AN/AUPD70F3558M1GMA-GBK-E3-AXRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
679
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N/AN/AUPD70F3558M1GMA1-GBK-AXRenesasIC MCU 32BIT 2MB FLASH 176HLQFPMicrocontrollers176-HLQFP (24x24)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
136
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 40x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-HLQFP (24×24)
Package / Case:
176-LQFP Exposed Pad
1,150
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N/AN/AUPD70F3564GD-FAD-AXRenesasIC MCU 32BIT FLASH SMDMicrocontrollersN/AN/AN/A

N/A

1,578
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N/AN/AUPD70F3564GDA-FAD-AXRenesasIC MCU 32BIT 2MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
161
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 48x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,573
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N/AN/AUPD70F3564GDA1-FAD-AXRenesasIC MCU 32BIT 2MB FLASH 272BGAMicrocontrollers272-BGA (21x21)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSI, Ethernet, FlexRay, I2C, LINbus, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
161
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
144K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 48x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
272-BGA (21×21)
Package / Case:
272-BGA
1,472
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UPD70F3570GBA-GAH-E3-AXN/AUPD70F3570GBA-GAH-E3-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
468
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UPD70F3570GBA-GAH-E3-QS-AXN/AUPD70F3570GBA-GAH-E3-QS-AXRenesasIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
441
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UPD70F3570GBA2-GAH-AX
UPD70F3570GBA2-GAH-AXRenesas32-BIT MCU V850E2/FX4-L A064_101Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,884
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UPD70F3570GBA2-GAH-E3-AX
UPD70F3570GBA2-GAH-E3-AXRenesas32BIT MCU V850E2/FX4-L A064_1010Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,013
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UPD70F3571GBA-GAH-AX
UPD70F3571GBA-GAH-AXRenesas32-BIT MCU V850E2/FX4-L A064_101Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
28K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
630
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UPD70F3572GBA-GAH-AXN/AUPD70F3572GBA-GAH-AXRenesasIC MCU 32BIT 512KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
561
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QUOTE
UPD70F3572GBA1-GAH-AX
UPD70F3572GBA1-GAH-AXRenesas32BIT MCU V850E2/FX4-LMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 110°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 110°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
536
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UPD70F3572GBA2-GAH-E2-QS-AX
UPD70F3572GBA2-GAH-E2-QS-AXRenesas32-BIT MCU V850E2/FX4-L A064_101Microcontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
707
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QUOTE
UPD70F3572GBA2-GAH-QS-AXN/AUPD70F3572GBA2-GAH-QS-AXRenesasIC MCU 32BIT 512KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
V850E2S
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
CANbus, CSI, I2C, LINbus, UART/USART
Peripherals:
DMA, LCD, LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
772
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QUOTE

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